Arcnano

Parent

Science and Engineering Physics Modeling, CAD Design, Finite Element Analysis, SBIR Partnering, STTR Partnering, Government Contracting, Sub-Contracting for Mil/Aero Primes Wafer Fab Products and Services Wafer Scale Fabrication: MEMs, Sensors, Devices Thin Film Deposition: Sputtering, Evaporation, CVD, ALD, Plating Patterning: Mask Design, GDS2 Format, Suss Front Side Back Side Mask Aligner, Canon Stepper, Heidelberg Direct Write Etching: Wet Etch, Ion Milling, RIE, DRIE, Ion Milling Wafer to Package Back End: BEOL, Chip Stacking; 2.5D, 3D Devices, Flip Chip, Laser Die Attach to Heat Sink, Photonic and Opto-Electronic Devices Wafer Back End Bare Die: Wafer Thinning, Dicing, Pick Out to Tape or Chip Tray Ultra High Precision Machining Services CNC 3 Axis and 5 Axis Milling, Wire EDM, Micro EDM, Grinding, Lapping, CMP Typical materials include hard steels, ceramics, titanium, molybdenum, Tungsten, Tantalum, and more Analytical Services SEM, EDS, XRF, FIB, AFM, MFM, TEM

Analytical Services, Atomic Force, Magnetic Force, Microscopy, Ellipsometry, Thermal, Focused Ion Beam, Profilometry, SEM, TEM, ElectroMagnets, Aperture Strips, Photonic Crystals, CAD/CAE, Instrumentation, Tooling Design, Magnetic Recording, Heads Nanotechnology, MicroAssembly, Manufacturing, Photolithography, Thin Films, Fabrication, Precision Components, Machining

ISO-9000 Series

http://www.arcnano.com

Saint Paul, MN
United States