Search SBIR/STTR Opportunities

Microelectronics Packaging and Systems Integration

Type: STTR • Topic: S4

Overview

Type
STTR Phase I
Topic Year
2021
Agency
National Science Foundation (NSF)
Structure
Grant
Release Date
Feb. 12, 2021
Open Date
Feb. 12, 2021
Close Date
Jan. 6, 2022 Past Due
Solicitation Source
https://www.nsf.gov/pubs/2021/nsf21563/nsf21563.htm
Topic Link
https://www.sbir.gov/node/1905383
NAICS
541715 - Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
PSC
DA01 - IT And Telecom - Business Application/Application Development Support Services (Labor)
National Science Foundation announced STTR Phase I titled Microelectronics Packaging and Systems Integration on 02/12/21. Applications for topic S4 (2021) open on 02/12/21 and close on 01/06/22.

Program Details

Phase Detail
Phase I: Establish the technical merit, feasibility, and commercial potential of the proposed R/R&D efforts and determine the quality of performance of the small business awardee organization.
Est. Value
$50,000 - $250,000
Duration
1 Year
Size Limit
500 Employees
Eligibility Note
Requires partnership between small businesses and nonprofit research institution

Awards

Contract and grant awards for topic S4 2021