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DEAR0001765

Cooperative Agreement

Overview

Grant Description
Jetcool Technologies Inc., DE-FOA-0002852 (COOLERCHIPS) (SBIR/STTR) new award.
Control #: 2852-1525.
Project title: Sub-One PUE through Silicon Cooling Efficiency.

Jetcool Technologies will improve the concentration of heat so that heat rejection to ambient becomes less energy and resource intensive. For example, through higher coolant temperatures and reduce the needed electricity by improving the fundamental efficiency at which the compute devices run.
Awardee
Jetcool Technologies
Funding Goals
PROJECTS FUNDED UNDER THE COOLING OPERATIONS OPTIMIZED FOR LEAPS IN ENERGY, RELIABILITY AND CARBON HYPEREFFICIENCY FOR INFORMATION PROCESSING SYSTEMS (COOLERCHIPS) PROGRAM WILL DEVELOP NOVEL HIGH PERFORMANCE, HIGH RELIABILITY COOLING SYSTEMS FOR COMPUTE ELECTRONICS. THESE COOLING SYSTEMS WILL ENABLE A NEW CLASS OF POWER-DENSE COMPUTATIONAL SYSTEMS, DATA CENTERS, AND MODULAR EDGE SYSTEMS THAT WILL BE COOLED USING 5% OR LESS OF THE IT LOAD AT ANY LOCATION IN THE UNITED STATES AT ANY TIME OF THE YEAR.
Grant Program (CFDA)
81.135 - Advanced Research Projects Agency - Energy
Awarding / Funding Agency
Advanced Research Projects Agency - Energy (ARPA-E) [DOE]
Place of Performance
Littleton, Massachusetts United States
Geographic Scope
City-Wide
Related Opportunity
Cooling Operations Optimized for Leaps in Energy, Reliability and Carbon Hyperefficiency for Information Processing Systems (COOLERCHIPS) (SBIR/STTR) (DE-FOA-0002852)
Jetcool Technologies was awarded Cooperative Agreement DEAR0001765 worth $1,265,719 from Advanced Research Projects Agency - Energy in September 2023 with work to be completed primarily in Littleton Massachusetts United States. The grant has a duration of 2 years and was awarded through assistance program 81.135 Advanced Research Projects Agency - Energy. The Cooperative Agreement was awarded through grant opportunity Cooling Operations Optimized for Leaps in Energy, Reliability and Carbon Hyperefficiency for Information Processing Systems (COOLERCHIPS) (SBIR/STTR).

SBIR Details

Research Type
SBIR Phase II
Title
Sub-One PUE through Silicon Cooling Efficiency
Abstract
To achieve a quantum step in data center efficiency, new thermal management technologies must be coupled to the devices they cool. This proposal seeks to build on recent observations that microconvective cooling not only functions as a high-performance chip cooling technique with the potential for a low PUE, but is also capable of increasing the intrinsic efficiency of the silicon processors themselves by 8-10%. By optimizing the system efficiency with the processor efficiency through intelligent cooling solutions, dramatic leaps in data center efficiency become possible.
Topic Code
1
Solicitation Number
DE-FOA-0002852

Status
(Complete)

Last Modified 6/24/25

Period of Performance
9/26/23
Start Date
9/25/25
End Date
100% Complete

Funding Split
$1.3M
Federal Obligation
$0.0
Non-Federal Obligation
$1.3M
Total Obligated
100.0% Federal Funding
0.0% Non-Federal Funding

Activity Timeline

Interactive chart of timeline of amendments to DEAR0001765

Transaction History

Modifications to DEAR0001765

Additional Detail

Award ID FAIN
DEAR0001765
SAI Number
None
Award ID URI
SAI EXEMPT
Awardee Classifications
Small Business
Awarding Office
897030 ADVANCED RSRCH PROJ AGENCY ARPA-E
Funding Office
897002 ADVANCED RSRCH PROJ AGENCY ARPA-E
Awardee UEI
EMTUCUWPLWK9
Awardee CAGE
89AT2
Performance District
MA-03
Senators
Edward Markey
Elizabeth Warren

Budget Funding

Federal Account Budget Subfunction Object Class Total Percentage
Advanced Research Projects Agency-Energy, Energy Programs, Energy (089-0337) Energy supply Research and development contracts (25.5) $1,265,719 100%
Modified: 6/24/25