DEAR0001763
Other Financial Assistance
Overview
Grant Description
This other transaction agreement (OTA) is awarded to NVIDIA Corporation for a project entitled, ''Embedded Microfluidic Cooling for Nextgen High Power Server Architectures”.
This award is being made in accordance with FOA number DE-FOA-0002851 (CoolerChips) and application control number 2851-1611.
NVIDIA Corporation will develop direct-to-chip pumped two-phase and immersion single-phase, are proposed to be combined to handle > 1 MW of IT load, which feature a 1000 W per GPU cooled using pumped two-phase cold plate (CP).
The lower power density parts, being encased in hermetically sealed server tanks, will be cooled by single-phase immersion.
The cooling solution is designed to reduce the cooling energy to its lowest possible limit and fit inside an ISO 40 shipping container.
To achieve the program objectives, an innovative two-phase porous metal CP technology will be utilized to achieve a thermal resistance as low as 0.0025°C/W for GPU surface area.
Allowing refrigerants to operate between 58-65°C while maintaining a case temperature of less than 73°C.
The heat will be dissipated to 40 °C ambient.
Separate dedicated energy efficient free coolers are equipped with cutting-edge technology to enable these coolers to reject heat with low approach temperatures and a potential ×4 footprint reduction.
Furthermore, an in-rack distributed pumping and flow separation system will replace conventional CDUs, targeting 30 PSI pressure drop and significant efficiency gain in pumping power.
The concept will enable the merging of primary and secondary cooling loops into one cycle.
By adopting these innovations, the cooling system power consumption will be limited to recirculating pumps (2.6% of the IT load) and the dry coolers’ fans (2.1% of the IT load), which brings down the total system power consumption to only 4.7% of the IT load.
This award is being made in accordance with FOA number DE-FOA-0002851 (CoolerChips) and application control number 2851-1611.
NVIDIA Corporation will develop direct-to-chip pumped two-phase and immersion single-phase, are proposed to be combined to handle > 1 MW of IT load, which feature a 1000 W per GPU cooled using pumped two-phase cold plate (CP).
The lower power density parts, being encased in hermetically sealed server tanks, will be cooled by single-phase immersion.
The cooling solution is designed to reduce the cooling energy to its lowest possible limit and fit inside an ISO 40 shipping container.
To achieve the program objectives, an innovative two-phase porous metal CP technology will be utilized to achieve a thermal resistance as low as 0.0025°C/W for GPU surface area.
Allowing refrigerants to operate between 58-65°C while maintaining a case temperature of less than 73°C.
The heat will be dissipated to 40 °C ambient.
Separate dedicated energy efficient free coolers are equipped with cutting-edge technology to enable these coolers to reject heat with low approach temperatures and a potential ×4 footprint reduction.
Furthermore, an in-rack distributed pumping and flow separation system will replace conventional CDUs, targeting 30 PSI pressure drop and significant efficiency gain in pumping power.
The concept will enable the merging of primary and secondary cooling loops into one cycle.
By adopting these innovations, the cooling system power consumption will be limited to recirculating pumps (2.6% of the IT load) and the dry coolers’ fans (2.1% of the IT load), which brings down the total system power consumption to only 4.7% of the IT load.
Awardee
Grant Program (CFDA)
Awarding / Funding Agency
Place of Performance
Santa Clara,
California
United States
Geographic Scope
City-Wide
Related Opportunity
None
Nvidia was awarded
Other Financial Assistance DEAR0001763
worth $5,000,006
from Advanced Research Projects Agency - Energy in January 2025 with work to be completed primarily in Santa Clara California United States.
The grant
has a duration of 3 years and
was awarded through assistance program 81.135 Advanced Research Projects Agency - Energy.
$5,142,855 (51.0%) of this Other Financial Assistance was funded by non-federal sources.
Status
(Ongoing)
Last Modified 7/8/25
Period of Performance
1/3/25
Start Date
1/2/28
End Date
Funding Split
$5.0M
Federal Obligation
$5.1M
Non-Federal Obligation
$10.1M
Total Obligated
Activity Timeline
Transaction History
Modifications to DEAR0001763
Additional Detail
Award ID FAIN
DEAR0001763
SAI Number
None
Award ID URI
SAI EXEMPT
Awardee Classifications
For-Profit Organization (Other Than Small Business)
Awarding Office
897030 ADVANCED RSRCH PROJ AGENCY ARPA-E
Funding Office
897002 ADVANCED RSRCH PROJ AGENCY ARPA-E
Awardee UEI
ESRLMLGWDNM3
Awardee CAGE
3DRE3
Performance District
CA-17
Senators
Dianne Feinstein
Alejandro Padilla
Alejandro Padilla
Modified: 7/8/25