70NANB24H251
Cooperative Agreement
Overview
Grant Description
Purpose: Octave Photonics seeks to develop a new measurement tool for critical metrology in the semiconductor fabrication that can analyze airborne contaminants and toxic gases inside and outside the fab that lead to semiconductor processing defects and safety infringements.
Activities to be performed: The awardee will design a photonic integrated circuit, measure baseline performance, and integrate their module within a commercial sensing system.
Expected outcomes: The infrared spectrometer system, integrated into a larger commercial instrument, will improve wafer yields, improve chip performance, and ensure long-term environmental sustainability for fabs.
Intended beneficiaries: U.S. fabrication facilities.
Subrecipient activities: The recipient plans to subaward funds to integrate their new system within the subrecipient's commercial instrument.
Activities to be performed: The awardee will design a photonic integrated circuit, measure baseline performance, and integrate their module within a commercial sensing system.
Expected outcomes: The infrared spectrometer system, integrated into a larger commercial instrument, will improve wafer yields, improve chip performance, and ensure long-term environmental sustainability for fabs.
Intended beneficiaries: U.S. fabrication facilities.
Subrecipient activities: The recipient plans to subaward funds to integrate their new system within the subrecipient's commercial instrument.
Awardee
Funding Goals
TO EXPLORE THE TECHNICAL MERIT OR FEASIBILITY OF AN INNOVATIVE IDEA OR TECHNOLOGY WITH THE AIM OF DEVELOPING A VIABLE PRODUCT OR SERVICE THAT WILL BE INTRODUCED TO THE COMMERCIAL MICROELECTRONICS MARKETPLACE.
Grant Program (CFDA)
Awarding / Funding Agency
Place of Performance
Louisville,
Colorado
80027-1130
United States
Geographic Scope
Single Zip Code
Octave Photonics was awarded
Cooperative Agreement 70NANB24H251
worth $290,000
from the National Institute of Standards and Technology in October 2024 with work to be completed primarily in Louisville Colorado United States.
The grant
has a duration of 2 years 5 months and
was awarded through assistance program 11.042 CHIPS Research and Development.
The Cooperative Agreement was awarded through grant opportunity Small Business Innovation Research (SBIR) Program for CHIPS For America – CHIPS Metrology.
SBIR Details
Research Type
SBIR Phase I
Title
Infrared Spectrometer for Semiconductor Process and Environmental Contaminant Testing in Realtime (INSPECTR)
Abstract
This project aims to develop a high-resolution, high-sensitivity mid-infrared spectrometer designed for fast, accurate chemical monitoring in advanced semiconductor fabrication facilities. The system will be capable of detecting a wide range of molecular impurities, such as trace gases and volatile compounds, that can negatively affect the performance of cutting-edge lithography systems, thin-film deposition, and epitaxial growth processes. Additionally, it will help mitigate risks to worker safety by identifying potentially hazardous substances in real time. The technology behind this mid-infrared system combines recent advances in chip-integrated
nanophotonics, precision spectroscopy, and optical frequency comb technology. At its core, the system features a novel photonic integrated circuit (PIC) that efficiently converts ultrashort nearinfrared laser pulses into optical frequency combs, spanning the 3 to 5 μm wavelength range of the mid-infrared. This wide spectral range enables multi-species detection, while the compact, chip-based platform ensures portability and ease of deployment in dynamic, high-tech
environments. The mid-infrared generation platform will be seamlessly integrated into a larger commercial instrument utilizing high-sensitivity optical frequency comb spectroscopy. This integrated system will monitor molecular impurities at parts-per-billion levels, both inside and around semiconductor fabrication facilities. Ultimately, the monitoring system will enhance productivity, improve product quality, ensure worker safety, and contribute to the long-term environmental sustainability of semiconductor fabrication facilities.
Topic Code
1
Solicitation Number
2024-SBIR-CHIPS-01
Status
(Ongoing)
Last Modified 10/4/24
Period of Performance
10/1/24
Start Date
3/30/27
End Date
Funding Split
$290.0K
Federal Obligation
$0.0
Non-Federal Obligation
$290.0K
Total Obligated
Activity Timeline
Additional Detail
Award ID FAIN
70NANB24H251
SAI Number
70NANB24H251_0
Award ID URI
EXE
Awardee Classifications
Small Business
Awarding Office
1333ND DEPT OF COMMERCE NIST
Funding Office
1333ND DEPT OF COMMERCE NIST
Awardee UEI
LZ6FL88D3NK3
Awardee CAGE
89R35
Performance District
CO-02
Senators
Michael Bennet
John Hickenlooper
John Hickenlooper
Modified: 10/4/24