2505353
Project Grant
Overview
Grant Description
SBIR Phase I: Efficient transfer technology for ultra-thin dies (UTD) in advanced semiconductor chip packaging.
The broader impact/commercial impacts of this Small Business Innovation Research (SBIR) Phase-I project is in increasing the USA footprint in the advanced semiconductor chip assembly and package equipment market.
The ultra-thin die (UTD) semiconductor chip devices are building blocks for a wide range of mobile and flexible electronics applications.
These UTD chips are very fragile and their handling during manufacturing is substantially different from traditional chips.
The handling and transfer of UTD chips is a major contributor to the package cost and yield, which are critical for new technologies.
In this project, an innovative technology will be developed for fast and precise transfer of UTD chips during semiconductor chip manufacturing.
Customers for this technology are the world-wide original device manufacturers and semiconductor foundries, for use in a wide range of consumer products.
This Small Business Innovation Research (SBIR) Phase-I project focuses on the introduction of a transfer technology capable of collectively transferring UTDs from the dicing tape to another substrate without the risk for die cracking, chipping or warpage.
The “one-die-at-a-time” vacuum-based transfer that dominates today’s equipment market utilizes vacuum and a needle to push the die away from the tape while the pickup tool lifts the die off of the needle and places it into the appropriate output carrier.
This technology is a major contributor to die stress and cracking, especially for UTDs.
As high-performance chips trend to increase in area and decrease in thickness (< 50 microns), the task of reliable peeling of UTDs from the dicing tape becomes more challenging.
To address this challenge, this project introduces two innovative methodologies/hardware components; the first of which is a vacuum-activated, patterned stage (VAPS) essential for initiating the collective delamination of all dice placed on a UV-sensitive dicing tape substrate, while the second is a pattern-sensitive individually addressable head for the electromagnetic pick and place of released dice.
This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the foundation's intellectual merit and broader impacts review criteria.
Subawards are not planned for this award.
The broader impact/commercial impacts of this Small Business Innovation Research (SBIR) Phase-I project is in increasing the USA footprint in the advanced semiconductor chip assembly and package equipment market.
The ultra-thin die (UTD) semiconductor chip devices are building blocks for a wide range of mobile and flexible electronics applications.
These UTD chips are very fragile and their handling during manufacturing is substantially different from traditional chips.
The handling and transfer of UTD chips is a major contributor to the package cost and yield, which are critical for new technologies.
In this project, an innovative technology will be developed for fast and precise transfer of UTD chips during semiconductor chip manufacturing.
Customers for this technology are the world-wide original device manufacturers and semiconductor foundries, for use in a wide range of consumer products.
This Small Business Innovation Research (SBIR) Phase-I project focuses on the introduction of a transfer technology capable of collectively transferring UTDs from the dicing tape to another substrate without the risk for die cracking, chipping or warpage.
The “one-die-at-a-time” vacuum-based transfer that dominates today’s equipment market utilizes vacuum and a needle to push the die away from the tape while the pickup tool lifts the die off of the needle and places it into the appropriate output carrier.
This technology is a major contributor to die stress and cracking, especially for UTDs.
As high-performance chips trend to increase in area and decrease in thickness (< 50 microns), the task of reliable peeling of UTDs from the dicing tape becomes more challenging.
To address this challenge, this project introduces two innovative methodologies/hardware components; the first of which is a vacuum-activated, patterned stage (VAPS) essential for initiating the collective delamination of all dice placed on a UV-sensitive dicing tape substrate, while the second is a pattern-sensitive individually addressable head for the electromagnetic pick and place of released dice.
This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the foundation's intellectual merit and broader impacts review criteria.
Subawards are not planned for this award.
Awardee
Funding Goals
THE GOAL OF THIS FUNDING OPPORTUNITY, "NSF SMALL BUSINESS INNOVATION RESEARCH / SMALL BUSINESS TECHNOLOGY TRANSFER PHASE I PROGRAMS", IS IDENTIFIED IN THE LINK: HTTPS://WWW.NSF.GOV/PUBLICATIONS/PUB_SUMM.JSP?ODS_KEY=NSF24579
Grant Program (CFDA)
Awarding / Funding Agency
Place of Performance
Hillsboro,
Oregon
97124-4901
United States
Geographic Scope
Single Zip Code
Luxnour Technologies was awarded
Project Grant 2505353
worth $304,507
from National Science Foundation in April 2025 with work to be completed primarily in Hillsboro Oregon United States.
The grant
has a duration of 1 year and
was awarded through assistance program 47.084 NSF Technology, Innovation, and Partnerships.
The Project Grant was awarded through grant opportunity NSF Small Business Innovation Research / Small Business Technology Transfer Phase I Programs.
SBIR Details
Research Type
SBIR Phase I
Title
SBIR Phase I: Efficient Transfer Technology for Ultra-Thin Dies (UTD) in Advanced Semiconductor Chip Packaging
Abstract
The broader impact/commercial impacts of this Small Business Innovation Research (SBIR) Phase-I project is in increasing the USA footprint in the advanced semiconductor chip assembly and package equipment market. The Ultra-thin die (UTD) semiconductor chip devices are building blocks for a wide range of mobile and flexible electronics applications. These UTD chips are very fragile and their handling during manufacturing is substantially different from traditional chips. The handling and transfer of UTD chips is a major contributor to the package cost and yield, which are critical for new technologies. In this project, an innovative technology will be developed for fast and precise transfer of UTD chips during semiconductor chip manufacturing. Customers for this technology are the world-wide original device manufacturers and semiconductor foundries, for use in a wide range of consumer products.
This Small Business Innovation Research (SBIR) Phase-I project focuses on the introduction of a transfer technology capable of collectively transferring UTDs from the dicing tape to another substrate without the risk for die cracking, chipping or warpage. The “one-die-at-a-time” vacuum-based transfer that dominates today’s equipment market utilizes vacuum and a needle to push the die away from the tape while the pickup tool lifts the die off of the needle and places it into the appropriate output carrier. This technology is a major contributor to die stress and cracking, especially for UTDs. As high-performance chips trend to increase in area and decrease in thickness (< 50 microns), the task of reliable peeling of UTDs from the dicing tape becomes more challenging. To address this challenge, this project introduces two innovative methodologies / hardware components; the first of which is a Vacuum-Activated, Patterned Stage (VAPS) essential for initiating the collective delamination of all dice placed on a UV-sensitive dicing tape substrate, while the second is a patter
Topic Code
S
Solicitation Number
NSF 24-579
Status
(Ongoing)
Last Modified 4/4/25
Period of Performance
4/1/25
Start Date
3/31/26
End Date
Funding Split
$304.5K
Federal Obligation
$0.0
Non-Federal Obligation
$304.5K
Total Obligated
Activity Timeline
Additional Detail
Award ID FAIN
2505353
SAI Number
None
Award ID URI
SAI EXEMPT
Awardee Classifications
Small Business
Awarding Office
491503 TRANSLATIONAL IMPACTS
Funding Office
491503 TRANSLATIONAL IMPACTS
Awardee UEI
FZBALDYJJ9K7
Awardee CAGE
7J9M9
Performance District
OR-01
Senators
Jeff Merkley
Ron Wyden
Ron Wyden
Modified: 4/4/25