2423304
Project Grant
Overview
Grant Description
SBIR Phase I: Strain-relief interconnection and encapsulation of perovskite/silicon tandems - The broader/commercial impact of this SBIR Phase I project is to increase the competitiveness of the United States in photovoltaic (PV) manufacturing through the development of advanced perovskite/silicon tandem technology.
Photovoltaics (PV) are an important energy source to reach 100% carbon-free electricity by 2035, and its annual deployment needs to quadruple to meet that target.
However, PV companies are suffering with low gross profit margins due to little-to-no product differentiation.
Perovskite/silicon tandem technology offers >30% higher efficiency than today’s best-in-class silicon PV technology.
This improved efficiency could drive down manufacturing cost of PVs and increase the profitability of US PV manufacturers.
The high efficiency panel also further discounts the balance-of-system cost, lowering the levelized cost of electricity, which, in turn, could accelerate the deployment of PV as the dominant energy source to power a sustainable future.
The intellectual merit of this project is in the demonstration of strain-relief interconnection and encapsulation technologies for perovskite/silicon tandem photovoltaics.
To address the challenges associated with the temperature-sensitive and mechanically delicate perovskite materials, this project will seek to first understand both the thermal and mechanical stress thresholds of tandem devices and then implement metallization and encapsulation strategies to minimize the thermal and mechanical stresses during the module fabrication processes, delivering reliable tandem modules.
This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the foundation's intellectual merit and broader impacts review criteria.
Subawards are not planned for this award.
Photovoltaics (PV) are an important energy source to reach 100% carbon-free electricity by 2035, and its annual deployment needs to quadruple to meet that target.
However, PV companies are suffering with low gross profit margins due to little-to-no product differentiation.
Perovskite/silicon tandem technology offers >30% higher efficiency than today’s best-in-class silicon PV technology.
This improved efficiency could drive down manufacturing cost of PVs and increase the profitability of US PV manufacturers.
The high efficiency panel also further discounts the balance-of-system cost, lowering the levelized cost of electricity, which, in turn, could accelerate the deployment of PV as the dominant energy source to power a sustainable future.
The intellectual merit of this project is in the demonstration of strain-relief interconnection and encapsulation technologies for perovskite/silicon tandem photovoltaics.
To address the challenges associated with the temperature-sensitive and mechanically delicate perovskite materials, this project will seek to first understand both the thermal and mechanical stress thresholds of tandem devices and then implement metallization and encapsulation strategies to minimize the thermal and mechanical stresses during the module fabrication processes, delivering reliable tandem modules.
This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the foundation's intellectual merit and broader impacts review criteria.
Subawards are not planned for this award.
Awardee
Funding Goals
THE GOAL OF THIS FUNDING OPPORTUNITY, "NSF SMALL BUSINESS INNOVATION RESEARCH (SBIR)/ SMALL BUSINESS TECHNOLOGY TRANSFER (STTR) PROGRAMS PHASE I", IS IDENTIFIED IN THE LINK: HTTPS://WWW.NSF.GOV/PUBLICATIONS/PUB_SUMM.JSP?ODS_KEY=NSF23515
Grant Program (CFDA)
Awarding / Funding Agency
Place of Performance
Tempe,
Arizona
85284-1808
United States
Geographic Scope
Single Zip Code
Beyond Silicon was awarded
Project Grant 2423304
worth $274,999
from National Science Foundation in September 2024 with work to be completed primarily in Tempe Arizona United States.
The grant
has a duration of 1 year and
was awarded through assistance program 47.084 NSF Technology, Innovation, and Partnerships.
The Project Grant was awarded through grant opportunity NSF Small Business Innovation Research / Small Business Technology Transfer Phase I Programs.
SBIR Details
Research Type
SBIR Phase I
Title
SBIR Phase I: strain-relief interconnection and encapsulation of perovskite/silicon tandems
Abstract
The broader/commercial impact of this SBIR Phase I project is to increase the competitiveness of the United States in photovoltaic (PV) manufacturing through the development of advanced perovskite/silicon tandem technology. Photovoltaics (PV) are an important energy source to reach 100% carbon-free electricity by 2035, and its annual deployment needs to quadruple to meet that target. However, PV companies are suffering with low gross profit margins due to little-to-no product differentation. Perovskite/silicon tandem technology offers >30% higher efficiency than today’s best-in-class silicon PV technology. This improved efficiency could drive down manufacturing cost of PVs and increase the profitability of US PV manufacturers. The high efficiency panel also further discounts the balance-of-system cost, lowering the levelized cost of electricity, which, in turn, could accelerate the deployment of PV as the dominant energy source to power a sustainable future.
The intellectual merit of this project is in the demonstration of strain-relief interconnection and encapsulation technologies for perovskite/silicon tandem photovoltaics. To address the challenges associated with the temperature-sensitive and mechanically delicate perovskite materials, this project will seek to first understand both the thermal and mechanical stress thresholds of tandem devices and then implement metallization and encapsulation strategies to minimize the thermal and mechanical stresses during the module fabrication processes, delivering reliable tandem modules.
This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
Topic Code
EN
Solicitation Number
NSF 23-515
Status
(Ongoing)
Last Modified 9/17/24
Period of Performance
9/1/24
Start Date
8/31/25
End Date
Funding Split
$275.0K
Federal Obligation
$0.0
Non-Federal Obligation
$275.0K
Total Obligated
Activity Timeline
Additional Detail
Award ID FAIN
2423304
SAI Number
None
Award ID URI
SAI EXEMPT
Awardee Classifications
Small Business
Awarding Office
491503 TRANSLATIONAL IMPACTS
Funding Office
491503 TRANSLATIONAL IMPACTS
Awardee UEI
ZH37XN9T8MR7
Awardee CAGE
9AUN4
Performance District
AZ-04
Senators
Kyrsten Sinema
Mark Kelly
Mark Kelly
Modified: 9/17/24