2335175
Cooperative Agreement
Overview
Grant Description
Sbir Phase II: Innovative Glass Inspection for Advanced Semiconductor Packaging -The broader/commercial impact of this Small Business Innovation Research (SBIR) Phase II project is to enhance the semiconductor industry. The development of the proposed technology will advance the creation of and reduce the cost of high-quality electronic products such as smartphones, laptops, televisions, AR/VR devices, 5G components, and data storage devices that will be commercially available to individual consumers.
This research project will have a substantial societal benefit on the revitalization of the US semiconductor industry by creating more American jobs, boosting national security and reducing the vulnerability of semiconductor devices to tampering and counterfeiting and giving the US a competitive edge in the global market. This Small Business Innovation Research (SBIR) Phase II project will create technology that will advance the creation of high-quality electronic products that will be commercially available to individual consumers.
The increasing use of glass panels for semiconductor packaging presents an opportunity to develop technology which will perform full surface inspection of these panels for defects. No nano-particle inspection technology exists for ?300 mm glass substrates for particles ?300 nm in diameter, such as those used in advanced semiconductor packaging.
The successful development of this highly sensitive process control technology will address these glass inspection pain points, with substantial improvements in yield for semiconductor packaging companies. This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria. - Subawards are not planned for this award.
This research project will have a substantial societal benefit on the revitalization of the US semiconductor industry by creating more American jobs, boosting national security and reducing the vulnerability of semiconductor devices to tampering and counterfeiting and giving the US a competitive edge in the global market. This Small Business Innovation Research (SBIR) Phase II project will create technology that will advance the creation of high-quality electronic products that will be commercially available to individual consumers.
The increasing use of glass panels for semiconductor packaging presents an opportunity to develop technology which will perform full surface inspection of these panels for defects. No nano-particle inspection technology exists for ?300 mm glass substrates for particles ?300 nm in diameter, such as those used in advanced semiconductor packaging.
The successful development of this highly sensitive process control technology will address these glass inspection pain points, with substantial improvements in yield for semiconductor packaging companies. This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria. - Subawards are not planned for this award.
Awardee
Funding Goals
NOT APPLICABLE
Grant Program (CFDA)
Awarding Agency
Place of Performance
San Jose,
California
95131-1338
United States
Geographic Scope
Single Zip Code
Related Opportunity
NOT APPLICABLE
Analysis Notes
Amendment Since initial award the End Date has been shortened from 02/28/26 to 01/31/25 and the total obligations have decreased 50% from $999,999 to $500,000.
Lumina Instruments was awarded
Cooperative Agreement 2335175
worth $500,000
from in March 2024 with work to be completed primarily in San Jose California United States.
The grant
has a duration of 10 months and
was awarded through assistance program 47.084 NSF Technology, Innovation, and Partnerships.
SBIR Details
Research Type
SBIR Phase II
Title
SBIR Phase II: Innovative Glass Inspection for Advanced Semiconductor Packaging
Abstract
The broader/commercial impact of this Small Business Innovation Research (SBIR) Phase II project is to enhance the semiconductor industry. The development of the proposed technology will advance the creation of and reduce the cost of high-quality electronic products such as smartphones, laptops, televisions, AR/VR devices, 5G components, and data storage devices that will be commercially available to individual consumers. This research project will have a substantial societal benefit on the revitalization of the US semiconductor industry by creating more American jobs, boosting national security and reducing the vulnerability of semiconductor devices to tampering and counterfeiting and giving the US a competitive edge in the global market.
This Small Business Innovation Research (SBIR) Phase II project will create technology that will advance the creation of high-quality electronic products that will be commercially available to individual consumers. The increasing use of glass panels for semiconductor packaging presents an opportunity to develop technology which will perform full surface inspection of these panels for defects. No nano-particle inspection technology exists for ≥300 mm glass substrates for particles ≤300 nm in diameter, such as those used in advanced semiconductor packaging. The successful development of this highly sensitive process control technology will address these glass inspection pain points, with substantial improvements in yield for semiconductor packaging companies.
This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
Topic Code
S
Solicitation Number
NSF 23-516
Status
(Complete)
Last Modified 2/20/25
Period of Performance
3/15/24
Start Date
1/31/25
End Date
Funding Split
$500.0K
Federal Obligation
$0.0
Non-Federal Obligation
$500.0K
Total Obligated
Activity Timeline
Transaction History
Modifications to 2335175
Additional Detail
Award ID FAIN
2335175
SAI Number
None
Award ID URI
SAI EXEMPT
Awardee Classifications
Small Business
Awarding Office
491503 TRANSLATIONAL IMPACTS
Funding Office
491503 TRANSLATIONAL IMPACTS
Awardee UEI
DJ9XG2G7HA96
Awardee CAGE
8L5E2
Performance District
CA-17
Senators
Dianne Feinstein
Alejandro Padilla
Alejandro Padilla
Modified: 2/20/25