2329784
Project Grant
Overview
Grant Description
U.S.-JAPAN UNIVERSITY PARTNERSHIP FOR WORKFORCE ADVANCEMENT AND RESEARCH & DEVELOPMENT IN SEMICONDUCTORS (UPWARDS) FOR THE FUTURE - The Chips and Science Act, signed into law on August 9, 2022, envisions new opportunities in accelerating progress in key technology areas, building the STEM workforce of tomorrow, and fostering partnerships with the private sector to enable this progress.
It offers a unique and historic opportunity to expand the nation's capacity for semiconductor production as well as to prepare the U.S. workforce for jobs in advanced manufacturing and engineering. Recognizing that a skilled and diverse pipeline of workers is vital to building a sustainable semiconductor industry, collaboration between government, academia, and the semiconductor industry is needed to ensure that education and research training programs are aligned with industry needs and that students are well-prepared to fill critical, in-demand roles.
The U.S.-Japan University Partnership for Workforce Advancement and Research & Development in Semiconductors (UPWARDS) for the Future represents a collaboration between six U.S. universities and five Japanese universities, working with industry partners, to provide advanced training and research opportunities to students, faculty, and professionals in an effort to address the demand for a highly trained microelectronics and semiconductor workforce and, as a result, build global and domestic capacity in the semiconductor field.
Activities to achieve such goals include targeted student exchange programs, professional certification opportunities, curriculum development, visiting faculty/researcher programs, and focused research projects leveraging the resources and expertise from each partner. Through a shared commitment to training and research, partners will complement and scale current efforts to broaden and support the semiconductor workforce pipeline.
This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
It offers a unique and historic opportunity to expand the nation's capacity for semiconductor production as well as to prepare the U.S. workforce for jobs in advanced manufacturing and engineering. Recognizing that a skilled and diverse pipeline of workers is vital to building a sustainable semiconductor industry, collaboration between government, academia, and the semiconductor industry is needed to ensure that education and research training programs are aligned with industry needs and that students are well-prepared to fill critical, in-demand roles.
The U.S.-Japan University Partnership for Workforce Advancement and Research & Development in Semiconductors (UPWARDS) for the Future represents a collaboration between six U.S. universities and five Japanese universities, working with industry partners, to provide advanced training and research opportunities to students, faculty, and professionals in an effort to address the demand for a highly trained microelectronics and semiconductor workforce and, as a result, build global and domestic capacity in the semiconductor field.
Activities to achieve such goals include targeted student exchange programs, professional certification opportunities, curriculum development, visiting faculty/researcher programs, and focused research projects leveraging the resources and expertise from each partner. Through a shared commitment to training and research, partners will complement and scale current efforts to broaden and support the semiconductor workforce pipeline.
This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
Awardee
Funding Goals
NOT APPLICABLE
Grant Program (CFDA)
Awarding / Funding Agency
Place of Performance
Seattle,
Washington
98195-0001
United States
Geographic Scope
Single Zip Code
Related Opportunity
NOT APPLICABLE
Analysis Notes
Amendment Since initial award the total obligations have increased 100% from $2,000,000 to $4,000,000.
University Of Washington was awarded
UPWARDS: U.S.-Japan Partnership for Semiconductor Workforce
Project Grant 2329784
worth $4,000,000
from National Science Foundation in September 2023 with work to be completed primarily in Seattle Washington United States.
The grant
has a duration of 5 years and
was awarded through assistance program 47.084 NSF Technology, Innovation, and Partnerships.
Status
(Ongoing)
Last Modified 10/6/23
Period of Performance
9/1/23
Start Date
8/31/28
End Date
Funding Split
$4.0M
Federal Obligation
$0.0
Non-Federal Obligation
$4.0M
Total Obligated
Activity Timeline
Subgrant Awards
Disclosed subgrants for 2329784
Transaction History
Modifications to 2329784
Additional Detail
Award ID FAIN
2329784
SAI Number
None
Award ID URI
SAI EXEMPT
Awardee Classifications
Public/State Controlled Institution Of Higher Education
Awarding Office
491501 TECHNOLOGY FRONTIERS
Funding Office
491501 TECHNOLOGY FRONTIERS
Awardee UEI
HD1WMN6945W6
Awardee CAGE
1HEX5
Performance District
WA-07
Senators
Maria Cantwell
Patty Murray
Patty Murray
Budget Funding
| Federal Account | Budget Subfunction | Object Class | Total | Percentage |
|---|---|---|---|---|
| Research and Related Activities, National Science Foundation (049-0100) | General science and basic research | Grants, subsidies, and contributions (41.0) | $4,000,000 | 100% |
Modified: 10/6/23