2304631

Sttr Phase I: Wafer-Integrated Soft Magnetic Composite Films for Inductors with High Power Density and Efficiency -The broader/commercial impact of this Small Business Technology Transfer (STTR) Phase I project is to revolutionize the miniature-powered integrated circuit (IC) converter market, widely used in cellular phones, Internet of Things devices, and microsensors. The technology will provide form factor reductions of various modules, leading to the further miniaturization of on-chip components.

A manufacturing facility can service several IC companies by providing foundry capabilities to integrate inductors according to each customer's design. The technology can provide US manufacturers of such devices with a significant competitive edge in the very large mobile electronics and miniature electronics markets both in commercial and defense markets. Establishing manufacturing capability in the US will support a revival of component packaging and back-end integration business.

Mobile device miniaturization is increasing at a rapid rate. In on-board power converters, passive components such as inductors and capacitors are among the largest components. The non-availability of IC-compatible, low-cost, soft magnetic cores with low loss, high frequency (>10MHz), and high saturation magnetization limits the implementation of on-chip inductors.

The project aims to create innovative, soft magnetic composite (SMC) materials for inductor cores. IC-compatible high-performance SMC films, with thicknesses that can be scaled to 50 microns and above without losing performance, will be developed for the first time. The project's initial goal will be to develop physical and electrochemical synthesis methodologies for high magnetic moment, low loss, SMC materials that can be used to fabricate on-chip inductors, replacing ferrite core-based inductors in circuits.

The approach can be scaled to handle different ranges of power and can be integrated on wafers, package substrates, or boards. These cores will enable inductor thickness to be reduced by at least 10 times for use in low form factor, point-of-use, direct current (DC) to DC power converters and IC voltage regulator circuitry.

This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria. - Subawards are planned for this award.

Himet Materials

THE GOAL OF THIS FUNDING OPPORTUNITY, "NSF SMALL BUSINESS INNOVATION RESEARCH (SBIR)/ SMALL BUSINESS TECHNOLOGY TRANSFER (STTR) PROGRAMS PHASE I", IS IDENTIFIED IN THE LINK: HTTPS://WWW.NSF.GOV/PUBLICATIONS/PUB_SUMM.JSP?ODS_KEY=NSF22551

47.084 - NSF Technology, Innovation, and Partnerships

National Science Foundation (NSF)

Miami, Florida 33174-1630 United States

Single Zip Code

22-551

Amendment Since initial award the End Date has been extended from 08/31/24 to 07/31/25.