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2304400

Project Grant

Overview

Grant Description
SBIR Phase I: Development of a Chip Technology for Cheaper and Easier Photonic Device Manufacturing - The broader impact/commercial potential of this Small Business Innovation Research (SBIR) Phase I project is the advancement of manufacturing technologies for industries such as telecommunications, data communications, sensors, and defense.

Most of the internet relies on data centers to process data, and this processing is accomplished via a device called an optical transceiver. These transceivers house an optical fiber, which is as thin as a single strand of human hair, attached to a chip device to transfer information to/from the data centers. The optical fiber is so small that it is very difficult to precisely connect the fiber to the chip, often resulting in performance losses.

With >100,000 transceivers per data center and >2,700 data centers in the United States, it is important to have good fiber connection for reduced power consumption and increased performance. Technology companies are also looking for chips with multiple fibers, making the need for better fiber placement even greater.

In this project, the company focuses on a new technology that makes fiber placement on a chip faster, more accurate, and cheaper. This new technology uses a special component that enables fiber placement with precision while improving the device performance 4 times.

This Small Business Innovation Research (SBIR) Phase I project addresses major pain points for optical transceiver companies: cost and time to package an optical fiber to a silicon photonic chip. The proposed product consists of a fusion splicing machine and a novel silicon dioxide mode converter. The mode converter localizes heat from the laser, enabling fusion while simultaneously decreasing the loss level. This technology packages silicon photonic devices without compromising performance. It significantly improves packaging speed from 10 minutes to 2 minutes, increases power efficiency by 4x, and provides a 50% savings.

The company has demonstrated coupling losses lower than the industry standard of 3 dB on specialty chips. The research objectives involve improving coupling losses to around 1 dB, demonstrating splicing with foundry chips, and improving the strength of the fusion splice for improved reliability. The completion of these objectives will result in extremely low loss photonic packaging applicable for use with foundry chips, increasing the commercialization potential of the technology.

This technology will enable customers to package single or multi-fiber devices with high efficiency, low cost, and at high volumes, ultimately increasing production capacity across many industries.

This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
Awarding / Funding Agency
Place of Performance
Rochester, New York 14618-1622 United States
Geographic Scope
Single Zip Code
Related Opportunity
None
Photonect Interconnect Solutions was awarded Project Grant 2304400 worth $274,996 from National Science Foundation in June 2023 with work to be completed primarily in Rochester New York United States. The grant has a duration of 1 year and was awarded through assistance program 47.084 NSF Technology, Innovation, and Partnerships.

SBIR Details

Research Type
SBIR Phase I
Title
SBIR Phase I: Development of a Chip Technology for Cheaper and Easier Photonic Device Manufacturing
Abstract
The broader impact/commercial potential of this Small Business Innovation Research (SBIR) Phase I project is the advancement of manufacturing technologies for industries such as telecommunications, data communications, sensors. and defense. Most of the internet relies on data centers to process data, and this processing is accomplished via a device called an optical transceiver. These transceivers house an optical fiber, which is as thin as a single strand of human hair, attached to a chip device to transfer information to/from the data centers. The optical fiber is so small that it is very difficult to precisely connect the fiber to the chip, often resulting in performance losses. With greater than100,000 transceivers per data center and greater than2,700 data centers in the United States, it is important to have good fiber connection for reduced power consumption and increased performance. Technology companies are also looking for chips with multiple fibers, making the need for better fiber placement even greater. In this project, the company focuses a new technology that makes fiber placement on a chip faster, more accurate, and cheaper. This new technology uses a special component that enables fiber placement with precision while improving the device performance 4 times. _x000D_ _x000D_ This Small Business Innovation Research (SBIR) Phase I project addresses major pain points for optical transceiver companies: cost and time to package an optical fiber to a silicon photonic chip. The proposed product consists of a fusion splicing machine and a novel silicon dioxide mode converter. The mode converter localizes heat from the laser, enabling fusion while simultaneously decreasing the loss level. This technology packages silicon photonic devices without compromising performance. It significantly improves packaging speed from 10 minutes to 2 minutes, increases power efficiency by 4X, and provides a 50% savings. The company has demonstrated coupling losses lower than the industry standard of 3 dB on specialty chips. The research objectives involve improving coupling losses to around 1 dB, demonstrating splicing with foundry chips, and improving the strength of the fusion splice for improved reliability. The completion of these objectives will result in extremely low loss photonic packaging applicable for use with foundry chips, increasing the commercialization potential of the technology. This technology will enable customers to package single or multi-fiber devices with high efficiency, low cost, and at high volumes, ultimately increasing production capacity across many industries._x000D_ _x000D_ This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
Topic Code
PH
Solicitation Number
NSF 22-551

Status
(Ongoing)

Last Modified 6/21/23

Period of Performance
6/15/23
Start Date
5/31/24
End Date
72.0% Complete

Funding Split
$275.0K
Federal Obligation
$0.0
Non-Federal Obligation
$275.0K
Total Obligated
100.0% Federal Funding
0.0% Non-Federal Funding

Activity Timeline

Interactive chart of timeline of amendments to 2304400

Additional Detail

Award ID FAIN
2304400
SAI Number
None
Award ID URI
SAI EXEMPT
Awardee Classifications
Small Business
Awarding Office
491503 TRANSLATIONAL IMPACTS
Funding Office
491503 TRANSLATIONAL IMPACTS
Awardee UEI
HJ5BVBLSAKM8
Awardee CAGE
9LQB4
Performance District
25
Senators
Kirsten Gillibrand
Charles Schumer
Representative
Joseph Morelle

Budget Funding

Federal Account Budget Subfunction Object Class Total Percentage
Research and Related Activities, National Science Foundation (049-0100) General science and basic research Grants, subsidies, and contributions (41.0) $274,996 100%
Modified: 6/21/23