Miniature Integrated Thermal Management Systems for 3D Heterogeneous Integration (Minitherms3D)

Background
The Miniature Integrated Thermal Management Systems for 3D Heterogeneous Integration (Minitherms3D) program seeks to revolutionize thermal management for three-dimensional heterogeneous integration (3DHI). The program aims to significantly reduce thermal resistances within the 3D stack and external to the stack of 3DHI systems, while increasing volumetric heat removal.

Grant Details
The Defense Advanced Research Projects Agency (DARPA) seeks innovative proposals for the research and development of compact thermal management technology scalable to an arbitrarily large number of high-power tiers in a 3D Heterogeneous Integration (3DHI) chip stack. Specific program goals include: 3D stacking of five tiers with total heat dissipation > 6.8 kW, with the heat rejection system limited to < 0.006 m3. The Minitherms3D program is structured as a 48-month, three-phase program with an 18-month Phase 1 (base), 18-month Phase 2 (option), and 12-month Phase 3 (option). The technical area focuses on multi-scale thermal management technologies within and outside a high-power 3DHI stack.

Eligibility Requirements
Eligible applicants include Federally Funded Research and Development Centers (FFRDCs), government entities, and other applicants. Organizational Conflicts of Interest, Cost Sharing/Matching, and Associate Contractor Agreement Clause are also outlined in the eligibility information.

Period of Performance
The estimated period of performance start is October 2023.

Grant Value
Approximately $69M of total funding is anticipated for awards made against this BAA. Multiple awards are anticipated with an anticipated funding type of 6.2. Types of instruments that may be awarded include procurement contract, grant, cooperative agreement or other transaction.

Place of Performance
No specific geographic location(s) for performance are provided.