Search Prime Contracts

W911NF24C0041

Definitive Contract

Overview

Government Description
Atomic Fusion Wafer Bonding Tool for Ultra-high-power Switches
Place of Performance
Vista, CA 92081 United States
Pricing
Fixed Price
Set Aside
Small Business Set Aside - Total (SBA)
Extent Competed
Full And Open Competition After Exclusion Of Sources
Est. Average FTE
4
Related Opportunity
None
Analysis Notes
Amendment Since initial award the Potential End Date has been extended from 02/28/26 to 05/31/26.
Partow Technologies was awarded Definitive Contract W911NF24C0041 (W911NF-24-C-0041) for Atomic Fusion Wafer Bonding Tool For Ultra-High-Power Switches worth up to $1,699,828 by OUSD Research & Engineering in March 2024. The contract has a duration of 2 years 2 months and was awarded through SBIR Topic Ultra-Pure Atomic Wafer Fusion for Ultra-Wide Bandgap, Ultra-High Power, High Thermal Conductivity Power Switches with a Small Business Total set aside with NAICS 541715 and PSC AJ11 via direct negotiation acquisition procedures with 4 bids received.

SBIR Details

Research Type
Small Technology Transfer Research Program (STTR) Phase II
Title
Atomic fusion wafer bonding tool for ultra-high power switches
Abstract
High power electronic systems with small Size, Weight and Power (SWaP) are required in many military and industrial applications. GaN and Ga2O3 are two ultra-wide band gap (UWBG) materials that are commonly used in power electronic applications, due to their high critical field and high electron mobility. The maximum output power in these materials is limited by near-junction Joule-heating, which in turn reduces device performance and reliability. The main approach to resolve heat dissipation problem is to use a high material with high thermal conductivity such as SiC as the substrate. Though, grown GaN on SiC shows higher thermal conductivity; however, the heat dissipation flow disrupts in the interface due to the defects in grown semiconductor material. The direct bonding of these semiconductors to SiC with an intermediate layer can increase the heat transfer in the junction and in turn helps to achieve higher performance and more reliable power electronic devices needed by Navy and DoD. Heterogeneous wafer bonding can be done using surface activation. Here, we will develop a bonding system that employs either surface activation or surface activated diffusion to achieve heterogenous bonding between semiconductor wafer and SiC wafer. In addition to power electronic systems, the developed surface activated bonding system can be used in developing heterogeneous wafer structures that are used in the integrated photonic applications. For example, transferring thin film lithium niobate (TFLN) to silicon wafer can provide the electro-optic and nonlinear properties required for amplification or high-fidelity modulation, where silicon photonic integrated circuits cannot achieve.
Research Objective
The goal of phase II is to continue the R&D efforts initiated in Phase I. Funding is based on the results achieved in Phase I and the scientific and technical merit and commercial potential of the project proposed in Phase II. STTRs are completed in conjunction with a research institution.
Partnered Research Institution
UCLA Samueli School of Engineering
Topic Code
OSD22B-004
Agency Tracking Number
O22B-004-0002
Solicitation Number
22.B
Contact
Lynn Petersen

Status
(Open)

Last Modified 2/19/26
Period of Performance
3/1/24
Start Date
5/31/26
Current End Date
5/31/26
Potential End Date
98.0% Complete

Obligations
$1.7M
Total Obligated
$1.7M
Current Award
$1.7M
Potential Award
100% Funded

Award Hierarchy

Definitive Contract

W911NF24C0041

Subcontracts

0

Activity Timeline

Interactive chart of timeline of amendments to W911NF24C0041

Transaction History

Modifications to W911NF24C0041

People

Suggested agency contacts for W911NF24C0041

Competition

Number of Bidders
4
Solicitation Procedures
Negotiated Proposal/Quote
Evaluated Preference
None
Performance Based Acquisition
Yes
Commercial Item Acquisition
Commercial Item Procedures Not Used
Simplified Procedures for Commercial Items
No

Other Categorizations

Subcontracting Plan
Plan Not Required
Cost Accounting Standards
Exempt
Business Size Determination
Small Business
Defense Program
None
DoD Claimant Code
None
IT Commercial Item Category
Not Applicable
Awardee UEI
PDT5WE8U2624
Awardee CAGE
6ZYP2
Agency Detail
Awarding Office
W911NF W6QK ACC-APG DURHAM
Funding Office
HQ0287
Created By
kenneth.belk
Last Modified By
kenneth.belk
Approved By
kenneth.belk

Legislative

Legislative Mandates
None Applicable
Performance District
CA-49
Senators
Dianne Feinstein
Alejandro Padilla
Representative
Mike Levin
Modified: 2/19/26