Wire Bonder Training and Preventative Maintenance

Background
The Defense Microelectronics Activity (DMEA), part of the Office of Secretary of Defense, is seeking advanced training and preventative maintenance for the RAPID Pro Ball Bonder, a critical piece of equipment for Microcircuit Assembly (MCA) projects. The contract aims to ensure that DMEA can effectively bond various package types, which is essential for their operations.

Work Details
The contractor shall provide a 5-day advanced training course for two operators at Kulicke & Soffa (KnS) covering:
1. Plastic package profile bonding parameters.
2. Ceramic package profile bonding parameters.
3. Bonding parameters for large to small footprints.
4. Training on EFO Wand and P-Part installation.
5. Correct programming steps to avoid damage during operation.

Additionally, the contractor shall perform annual preventative maintenance which includes:
1. Annual preventative maintenance and periodic calibrations beyond warranty requirements for the RAPID Pro Ball Bonder in 2026.
2. Replacement of all high-wear items to restore machine functionality to OEM specifications.
3. Provision of software upgrades for the RAPID Pro Ball Bonder.

Period of Performance
The contract includes a base year for initial training and preventative maintenance in 2026, with options for annual maintenance and updates extending through 2029.

Place of Performance
Training and maintenance will be conducted onsite at Kulicke & Soffa (KnS).

Bidder Requirements
The contractor must be Kulicke & Soffa (K&S), as they are the Original Equipment Manufacturer (OEM) of the RAPID Pro Ball Bonder and hold proprietary rights to necessary software, diagnostic tools, and technical specifications required for proper maintenance and training.