Wafer Surface Roughness Metrology Tool
ID: HQ072718QJW06 • Type: Synopsis Solicitation
• Match:
95%
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Overview
Response Deadline
Sept. 10, 2018, 5:00 p.m. EDT
Past Due
Posted
Aug. 31, 2018, 3:06 p.m. EDT
Set Aside
None
Place of Performance
4234 54th Street
MCCLELLAN, CA 95652
USA
Source
Current SBA Size Standard
1000 Employees
Pricing
Likely Fixed Price
Est. Level of Competition
Average
On 8/31/18 Defense Microelectronics Activity issued Synopsis Solicitation HQ072718QJW06 for Wafer Surface Roughness Metrology Tool due 9/10/18.
The opportunity was issued full & open with NAICS 334516 and PSC 66.
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Additional Details
Source Agency Hierarchy
DEPT OF DEFENSE > DEFENSE MICROELECTRONICS ACTIVITY (DMEA) > DEFENSE MICROELECTRONICS ACTIVITY
FPDS Organization Code
9771-HQ0727
Source Organization Code
100139030
Last Updated
May 17, 2019
Last Updated By
PI33_DR_IAE_51681
Archive Date
May 17, 2019