Technologies for Heat Removal in Electronics at the Device Scale (THREADS)   3

Background
The THREADS program, titled Technologies for Heat Removal in Electronics at the Device Scale (THREADS), aims to develop technologies to overcome transistor thermal limitations and realize robust high-power density transistors that operate near their fundamental electronic limit of radio frequency (RF) output power. The program is structured as a 48-month, 3-phase program with an 18-month Phase 1 (base), 18-month Phase 2 (option), and 12-month Phase 3 (option) with one technical area. The program is anticipated to start in August 2023.

Work Details
The program has one technical area focusing on addressing two major technical challenges: reducing transistor thermal resistance and demonstrating reliable, efficient power amplifiers (PAs) with specific RF power density goals. The proposal should include detailed descriptions of the technical tasks/subtasks to be performed, their durations, dependencies among them, completion criteria, and deliverables. It should also provide schedules of measurable milestones for the proposed research and explain the technical approach(es) that will be employed to meet or exceed each program metric.

Period of Performance
The THREADS program is a 48-month effort anticipated to start in August 2023.