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Semiconductor Die Bonding and Vacuum Packaging System

ID: N00173-26-RFI-KN02 • Type: Sources Sought • Match:  85%
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Description

NOTE: THIS IS NOT A SOLICITATION OR AN INDICATION THAT A CONTRACTUAL COMMITMENT WILL EXIST AS A RESULT OF THIS RFI. This Sources Sought Notice (SSN) is in support of market research and procurement planning being conducted by the Naval Research Laboratory (NRL), Washington, DC. This SSN is for informational and planning purposes only and does not guarantee that this will be competed via SAM.GOV. The Government assumes NO financial responsibility for any costs incurred. A solicitation package is not available at this time.

OBJECTIVE: The intent of this RFI is to gauge industry interest and search for potential sources capable of fulfilling a requirement for Semiconductor Die Bonding and Vacuum Packaging System in accordance with the attached draft specifications. The Government is currently in the planning stages for this procurement and may continue to modify the language within the requirement as necessary. These specifications do not necessarily represent the final specifications.

CONTRACTOR RESPONSE FORMAT: Interested parties, at a minimum, shall supply all of the below required information in a Capability Statement. (Reference RFI N00173-26-RFI-KN02 in your response)

1. CONTACT INFORMATION

a) Company Name and Address

b) Point of Contact for question/clarification

c) Telephone Number and e-mail address

d) Unique Entity ID and CAGE Code

e) PSC Code of the proposed solution (SEE https://psctool.us)

f) Business Size/Socioeconomic Categories

2. TECHNICAL INFORMATION:

a) List of capabilities/resources relevant to the attached specifications.

b.) Any questions/suggestions related to the Specifications

3. COMMERCIALITY OF PROPOSED ITEM

a) Whether item(s) offered/proposed is a commercial item and is customarily used by the general public or non-government entities for the other than Government purposes.

b) Whether the item has been sold, leased, or licensed to the general public, and if so, identify one or more such sales, leases, or licenses to document the commerciality of the item.

c) If the manufacturer of the component, please confirm if Authorized Resellers are available.

ADDITIONAL REQUIREMENT DETAILS:

Responses should be no more than 10 pages and should be emailed to the Contract Specialist at
kevin.nguyen3.civ@us.navy.mil; and to the Contrcting Officer at jamie.l.dixon8.civ@us.navy.mil.

Background
The Naval Research Laboratory (NRL) in Washington, DC is conducting market research and procurement planning for a requirement involving a Semiconductor Die Bonding and Vacuum Packaging System.

This Sources Sought Notice (SSN) aims to gauge industry interest and identify potential sources capable of fulfilling this requirement. The specifications provided are draft and may be modified as the procurement process continues.

Work Details
The contractor will provide die bonding and vacuum reflow equipment for mounting and sealing experimental chips to chip carriers and multi-chip module assemblies.

The system must include:
1. Die Bonding System: Capable of attaching semiconductor die to substrates with robotic vacuum transfer mechanisms, image recognition for alignment, epoxy bonding, and flip-chip bonding capabilities. Specific requirements include:
- Working area of 36 x 20 inches minimum.
- Automated transfer of die sizes from 2 x 2 mm to 25 x 25 mm.
- Placement accuracy ≤ 5 micrometers, 3σ.
- Placement rate ≥ 200 placements/hour.
- Calibration load cell for automated force calibration.
- Z-axis range of 2 inches minimum.
- Optical vision system with cameras for alignment.
- Options for dry pump support, dual dispense systems, tip cleaning stations, pulsed heat stages, and full computer control.
2. Vacuum Reflow Furnace: Required for hermetic sealing of chip carriers with capabilities including:
- Accepting mounting plates up to 4 x 5 inches.
- Programmable temperature profiles with at least three settable steps.
- Operating temperature range from room temperature to 450C.
- Achieving vacuum pressures of 100 milliTorr or less using dry pump technologies.
- Options for formic acid delivery systems, residual gas analyzers, machined tooling support, and process development assistance.

Period of Performance
The geographic location(s) the contract will be performed (if provided).

Place of Performance
The contract work will be performed at the Naval Research Laboratory located in Washington DC.

Bidder Requirements
Interested bidders must provide a Capability Statement that includes company contact information, technical capabilities relevant to the specifications, commerciality details of proposed items, and any questions or suggestions regarding the specifications. Specific qualifications or certifications are not detailed in the solicitation.
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Overview

Agency
Naval Research Laboratory (NRL)
Response Deadline
July 1, 2026, 12:00 p.m. EDT Due in 14 Days
Posted
June 16, 2026, 8:09 p.m. EDT
Set Aside
None
NAICS
None
PSC
None
Place of Performance
Washington, DC 20375 United States
Source
Open
Est. Level of Competition
Average
Est. Value Range
Experimental
$350,000 - $900,000 (AI estimate)
On 6/16/26 Naval Research Laboratory issued Sources Sought N00173-26-RFI-KN02 for Semiconductor Die Bonding and Vacuum Packaging System due 7/1/26.
Primary Contact
Name
KEVIN NGUYEN   Profile
Email
kevin.nguyen3.civ@us.navy.mil
Phone
None

Secondary Contact

Name
Jamie Dixon   Profile
Email
jamie.l.dixon8.civ@us.navy.mil
Phone
(202) 923-1466

Documents

Posted documents for Sources Sought N00173-26-RFI-KN02

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Additional Details

Source Agency Hierarchy
DEPT OF DEFENSE > DEPT OF THE NAVY > ONR > ONR NRL > NAVAL RESEARCH LABORATORY
FPDS Organization Code
1700-N00173
Source Organization Code
100255323
Last Updated
June 16, 2026
Last Updated By
jamie.l.dixon8.civ@us.navy.mil
Archive Date
July 16, 2026