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Seal Bond Removal

ID: AF231-D016 • Type: SBIR / STTR Topic • Match:  90%
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Description

OUSD (R&E) CRITICAL TECHNOLOGY AREA(S): Advanced Materials OBJECTIVE: To develop a pulse hand-held laser to remove nitrile-phenolic resin from aircraft surfaces. DESCRIPTION: Hand-held laser technology developed for aircraft skin paint removal has not been tailored for nitrile-phenolic film adhesive removal, partly because the nitrile-phenolic film adhesive is a niche application it falls between the realm of structural bonding and sealing. The F-16 makes extensive use of nitrile-phenolic heat cured adhesives. Breaking the adhesive bonds requires cryogenic treatment to induce brittleness and leaves a significant amount of residue on parts. At present this residue is removed using 100% methyl-ethyl-ketone (MEK) and non-metallic scrapers. This method is extremely time consuming, but sanding and similar methods are not appropriate because many of the bonded components are fracture critical parts (surface must not have scratching or gouging to minimize the risk towards developing cracks). A method that would quickly and fully remove the residue without damaging the parts would represent a significant time savings and would remove 100% MEK from the work environment. To fulfill the objective of removing the residue after the cryogenic treatment, new methods are being researched and tested. PACAF depot contractor Korean Airlines uses a locally made portable water jet for removal. However, as the water jet is locally made, it is not available for Hill AFB or USAFE. This approach also generates a need to remediate the wastewater stream. Another method that has been tested but not approved is a hand-held pulse laser system. The laser system has proven to remove the adhesive, but testing has not been done with regards to structural fatigue or environmental concerns regarding decomposition. PHASE I: FEASABILITY DOCUMENTATION. For this Direct-to-Phase II topic, applicants must demonstrate the feasibility to remove Nitrile-Phenolic heat cured adhesives (FMS-3014) in an aircraft maintenance environment. PHASE II: Develop a working prototype to remove nitrile-phenolic adhesives from F-16 aircraft components. A complete successful nitrile-phenolic adhesive removal hand held laser prototype would be demonstrated through tests as recommended by the F-16 System Program Office. PHASE III DUAL USE APPLICATIONS: Refine hardware and software to increase accuracy and reliability. Achieve production-ready state for marketing to the Air Force, other related federal agencies, and private industry. REFERENCES: 1. Matthew Campbell, Laser System for Supplemental Coatings Removal Test Plan, ADB379774; 2. Ms. Shanna Denny, Mr. Juan Valencia, and Mr. Mark Phillippi, Mr. Jim Arthur, Optimization Of Aircraft Laser Coating Removal Processes Final Report, ADB397147; 3. Ms. Shanna Denny and Mr. James Arthur Jr., Optimization Of Aircraft Laser Coating Removal Processes Test Plan, ADB387150; 4. Shanna Denny/Matthew Campbell, Develop and Demonstrate Hand-Held Aircraft Laser Coating Removal in a Production Environment Final Report, ADB393963; 5. Mongelli, Gerard, Portable Handheld Laser Small Area Supplemental Coatings Removal System Final Report, ADA606886. KEYWORDS: Bond seal removal; Nitrile-Phenolic

Overview

Response Deadline
March 8, 2023 Past Due
Posted
Jan. 11, 2023
Open
Feb. 8, 2023
Set Aside
Small Business (SBA)
Place of Performance
Not Provided
Source
Alt Source

Program
SBIR Phase I / II
Structure
Contract
Phase Detail
Phase I: Establish the technical merit, feasibility, and commercial potential of the proposed R/R&D efforts and determine the quality of performance of the small business awardee organization.
Phase II: Continue the R/R&D efforts initiated in Phase I. Funding is based on the results achieved in Phase I and the scientific and technical merit and commercial potential of the project proposed in Phase II. Typically, only Phase I awardees are eligible for a Phase II award
Duration
6 Months - 1 Year
Size Limit
500 Employees
On 1/11/23 Department of the Air Force issued SBIR / STTR Topic AF231-D016 for Seal Bond Removal due 3/8/23.

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