Quantum Sensors In a Chip (QuSIC) Request for Information (RFI)

Background
Quantum systems as sensors have been studied for decades. DARPA believes that recent developments encourage a fundamental reassessment of quantum sensor architectures with an eye to enabling the exploitation of the inherent scalability of advanced photonic and MEMS processes. The goal of this Request for Information (RFI) is to understand the current state of the art and how recent advances can be leveraged to address the challenges that prevent the realization of fully-integrated quantum systems in chips.

Work Details
DARPA is seeking information regarding the integration of quantum systems into a chip, including atom sources, photonic routing, RF control, atomic readout, optical pumping, and any necessary bias controls into fully-contained, micro-fabricated chips. DARPA is interested in the following classes of quantum systems: (1) thermal atoms/ions, (2) thermal atom beams, (3) cold atoms/ions, and (4) solid-state defects. Furthermore, DARPA is interested in how these micro-fabricated quantum chips will be developed to enable sensing applications such as magnetometry, electrometry, gravimetry, timing, inertial measurement units (IMUs), ionizing radiation detection, and reference oscillators.

Period of Performance
Responses to this RFI will be used to organize topics and select speakers for a workshop to be held on or about April 10, 2024.