Scope Title:Photonic Integrated CircuitsScope Description:Photonic integrated circuits (PICs) are a revolutionary technology that enable complex optical functionality in a simple, robust, reliable, chip-sized package with very low size, weight, and power (SWaP), extremely high performance, and low cost. PICs are the optical analog to electrical integrated circuits (EICs). In the same way that EICs replaced vacuum tubes and other bulk electrical components, PICs are revolutionizing the generation and manipulation of light (photons), replacing free-space optics and parts with chip-based optical waveguides and components. This technology has been pioneered in the telecommunications industry but much of the functionality and components are also directly applicable to science measurements and spacecraft technologies. NASA is interested in the development and maturation of photonic integrated circuit (PIC) technology for infusion into existing and upcoming instruments. For the purposes of this call, PIC technology is defined as one or more lithographically defined photonic components or devices (e.g., lasers, detectors, waveguides/passive structures, modulators, electronic control, and optical interconnects) on a single platform allowing for manipulation and confinement of light at or near the wavelength scale. PICs can enable size, weight, and power (SWaP) and cost reductions and improve the performance of science instruments, subsystems, and components. PIC technologies are particularly critical for enabling small spacecraft platforms, rovers, and wearable/handheld technology for astronauts. Proposals should clearly demonstrate how the proposed PIC component or subsystem will demonstrate improved performance: reduced SWaP and cost; increased robustness to launch, space, and entry/landing environments; and/or entirely new measurement functionalities when compared to existing state-of-the-art bulk fiber-optic technology. Additional clarifications:On-chip generation, manipulation, and detection of light in a single-material system may not be practical or offer the best performance, so hybrid packaging of different material systems are also of interest.Often the full benefits of photonic integration are only realized when combined with integrated electronics. Proposals that leverage co-integrated electronics for new/improved PIC functionality are invited, but should consider the ultimate space environment.There are advantages to development of PIC technology in existing open access foundries to enable low cost, continued support, commercialization, and cross-compatibility with other development efforts. General NASA areas of interest for PIC components and subsystems include, but are not limited to:3D mapping and spectroscopic lidar systems and components.Sensors for rovers, landers, and probes.PIC-based analog radio-frequency (RF), microwave, submillimeter, and terahertz signal processing. Several existing needs at NASA for PIC technology include:PICs suitable for terahertz spectroscopy, microwave radiometry, and hyperspectral microwave sounding needing integrated high-speed electro-optic modulators, optical filters with tens of GHz free-spectral-range and few GHz resolution. Ka-band operation of RF photonic up/down frequency converters and filters need wideband tunability (>10 GHz) and <1 GHz instantaneous bandwidth.Spectrometers:Spectrometers or enabling spectrally resolving components with sufficient resolution to resolve atomic isotopes (e.g., carbon, oxygen, and hydrogen), with some examples including at least 0.02 cm-1 resolution at 2,196 cm-1 (>100k resolving power) and at least 0.02 cm-1 resolution at 1,294 cm-1 (>50k resolving power).Miniature spectrometers with high resolution (resolving power >10k) and high dynamic range (>4 orders of magnitude) in the 1.6 to 2.0 m band for fire detection.Spectrometers or spectrally resolving components capable of highly multimode (10+) and/or imaging operation on a single chip.On-chip detectors with high responsivity/quantum efficiency from 300 to 800 nm and >1.6 m. Note that approaches which package on-chip waveguides to off-chip detectors using small-form-factor packaging techniques (direct edge coupling, flip-chip, photonic wirebonding, etc.) are also of interest. Additionally, approaches demonstrated in, or compatible with, commercial foundries are of particular interest.Avalanche photodiodes or similar single photon sensitive detectors in any wavelength range.Packaging approaches and on-chip coupling components for high-density, high-bandwidth, and/or misalignment-tolerant connections to single mode and multimode optical fiber, in any wavelength range. Note that photonic lanterns, mode size converters, 3D-written waveguide arrays, fiber arrays, and other off-chip coupling components must be packaged with a PIC to be considered responsive. In this case, the PIC should allow for measurement of total insertion loss but need not have any additional functionality. Note that proposals demonstrating a new coupler design will preferably focus on coupler design in a commercial foundry process. Designs and methods for coupling a single mode waveguide to a large-area beam (>1 mm diameter) emitted with high efficiency (<6 dB insertion loss) directly from the chip surface without an external lens. Both beam-steering and static approaches are invited. Example approaches include optical phased arrays, large-area grating couplers, and metalens-based structures. Note that approaches utilizing an on-chip fabricated lens (i.e., deposited on the chip surface) are also invited. Expected TRL or TRL Range at completion of the Project: 3 to 5Primary Technology Taxonomy: Level 1 08 Sensors and InstrumentsLevel 2 08.1 Remote Sensing Instruments/SensorsDesired Deliverables of Phase I and Phase II:ResearchAnalysisPrototypeHardwareDesired Deliverables Description:Phase I does not need to include a physical deliverable to the government but it is best if it includes a demonstration of feasibility through measurements. This can include extensive modeling, but a stronger proposal will have measured validation of models or designs. Phase II should include prototype delivery to the government. (It is understood that this is a research effort and the prototype is a best-effort delivery where there is no penalty for missing performance goals.) The Phase II effort should be targeting a commercial product that could be sold to the government and/or industry. State of the Art and Critical Gaps:There is a critical gap between discrete and bulk photonic components and waveguide multifunction PICs. The development of PICs permits SWaP and cost reductions for spacecraft microprocessors, communication buses, processor buses, advanced data processing, and integrated science instrument optical systems, subsystems, and components. This is particularly critical for small spacecraft platforms. Relevance / Science Traceability:Exploration Systems Development Mission Directorate (ESDMD) and Space Operations Mission Directorate (SOMD) Astronaut health monitoring. Science Mission Directorate (SMD) Earth, planetary, and astrophysics compact science instrument (e.g., optical and terahertz spectrometers and magnetometers on a chip and lidar systems and subsystems). (See Earth Science and Planetary Science Decadal Surveys) Space Technology Mission Directorate (STMD) Game-changing technology for small spacecraft navigation (e.g., laser ranging and gyroscopes). Small Business Technology Transfer (STTR) Exponentially increasing interest in programs at universities and startups in integrated photonics. Space Technology Roadmap 6.2.2, 13.1.3, 13.3.7, all sensors, 6.4.1, 7.1.3, 10.4.1, 13.1.3, 13.4.3, 14.3.3. References:1. AIM integrated photonics: http://www.aimphotonics.com2. Kish, Fred; Lal, Vikrant; Evans, Peter; et al.: System-on-Chip Photonic Integrated Circuits. IEEE Journal of Selected Topics in Quantum Electronics, vol. 24, issue 1, Article Number 6100120, Jan.-Feb. 2018.3. Thylen, Lars; Wosinski, Lech: Integrated Photonics in the 21st Century. Photonics Research, vol. 2, issue 2, pp. 75-81, April 2014.4. Chovan, Jozef; Uherek, Frantisek: Photonic Integrated Circuits for Communication Systems. Radioengineering, vol. 27, issue 2, pp. 357-363, June 2018.5. Lin, Hongtao; Luo, Zhengqian; Gu, Tian; et al.: Mid-infrared Integrated Photonics on Silicon: A Perspective. Nanophotonics, vol. 7, issue 2, pp. 393-420, Feb. 2018.6. de Valicourt, Guilhem; Chang, Chia-Ming; Eggleston, Michael S.; et al.: Photonic Integrated Circuit Based on Hybrid III-V/Silicon Integration. Journal of Lightwave Technology, vol. 36, issue 2, Special Issue, pp. 265-273, Jan. 15, 2018.7. Munoz, Pascual; Mico, Gloria; Bru, Luis A.; et al.: Silicon Nitride Photonic Integration Platforms for Visible, Near-Infrared and Mid-Infrared Applications. Sensors, vol. 17, issue 9, Article Number 2088, Sept. 2017.8. Fridlander, et al.: Photonic Integrated Circuits for Precision Spectroscopy, 2020 Conference on Lasers and Electro-Optics, paper SF3O.3 (CLEO 2020).9. Turner, et al.: Ultra-Wideband Photonic Radiometer for Submillimeter Wavelength Remote Sensing, International Topical Meeting on Microwave Photonics 2020.
