Multiple Award PCB Fab and Assembly BPAs

(Correction on 23 March 2023 - to correct a 1 day error on the proposal due date)

DMEA's mission includes developing electronics solutions that solve DoD obsolescence issues and/or provides state of the art SatCom solutions to DoD Programs. As such, there is a need to (1) rapidly produce developmental Printed Circuit Board Assemblies (PCBAs) for initial design and development use, (2) quickly produce prototype PCBAs for design validation, and (3) manufacture high quality PCBAs for use in DoD operational environments.

The purpose of this solicitation to is to competitively establish a pool of qualified BPA holders in order to rapidly obtain electronics products from industry and commercial PCB Fabrication and/or Assembly companies; specifically those produced by PCB Fabrication and PCB Assembly processes. Maximum ordering ceiling for each BPA holder is $1.2M over a 3 year period.

Additionally, the second phase of proposal and evaluation described in this solicitation serves as an RFQ for an actual order of PCBs, for which the Government anticipates multiple initial orders to be placed to have 500 units PCBs delivered.

Interested and capable PCB fabrication and/or PCB assembly vendors are highly encouraged to provide a proposal as instructed herein. Please see attached combined solicitation/synopsis, PWS for BPA scope, proposal instructions and evaluation criteria, and DRAFT BPA Agreement language.

Proposals are due to the Contracting Officer, Robert Crandell, via e-mail to robert.d.crandell.civ@mail.mil, no later than 2:00pm (Pacific), Tuesday, 4 April 2023.