Multiple Award PCB Fab and Assembly BPAs 2026-2030

ID: HQ072725QRT04 • Type: Synopsis Solicitation • Match: 90%

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Description

Posted: Aug. 15, 2025, 2:14 p.m. EDT

Re-attached PWS document that did not load previously. Extended due date to Monday 18 Aug 2025.

DMEA's mission includes developing electronics solutions that solve DOD
obsolescence issues and/or provides state of the art SatCom solutions to
DOD Programs. As such, there is a need to (1) rapidly produce
developmental Printed Circuit Board Assemblies (PCBAs) for initial design
and development use, (2) quickly produce prototype PCBAs for design
validation, and (3) manufacture high quality PCBAs for use in DOD
operational environments.

DMEA intends to competitively issue multiple BPA agreements to all qualifying offerors,
in accordance with FAR 13.106-1(a)(2)(iv). The purpose of this solicitation to is to competitively establish a pool of
qualified BPA holders in order to rapidly obtain electronics products from
industry and commercial PCB Fabrication and/or Assembly companies;
specifically those produced by PCB Fabrication and PCB Assembly
processes. Maximum ordering ceiling for each BPA holder is ($7.5million / divided by # of qualified offeror.)

No individual PCB orders will be awarded at this time, this Combined Synopsis/Solicitation is to competitively establish BPA agreeements with qualified vendors.

Interested and capable PCB fabrication and/or PCB assembly vendors are
highly encouraged to provide a proposal as instructed herein. Please see
attached combined solicitation/synopsis, PWS for BPA scope, proposal
instructions and evaluation criteria, and DRAFT BPA Agreement language.
Proposals are due to the contract specialist, Ryan Tung via e-mail to ryan.c.tung.civ@mail.mil, no later than 2:00pm (Pacific), Friday, 15 August 2025.

Posted: July 29, 2025, 5:11 p.m. EDT

Posted: July 25, 2025, 2:20 p.m. EDT

Posted: July 24, 2025, 4:55 p.m. EDT

Background
The Defense Microelectronics Activity (DMEA) is focused on developing electronics solutions to address obsolescence issues and provide state-of-the-art satellite communication (SatCom) solutions for Department of Defense (DOD) programs.

The goal of this contract is to establish multiple Blanket Purchase Agreements (BPAs) with qualified vendors to rapidly obtain Printed Circuit Board Assemblies (PCBAs) for various stages of design and operational use, including initial design, prototype validation, and high-quality manufacturing for DOD environments.

Work Details
The contract involves the production of developmental PCBAs, prototype PCBAs, and high-quality PCBAs.

The specific requirements include:
1. Rapid production of developmental PCBAs for initial design and development use.
2. Quick production of prototype PCBAs for design validation.
3. Manufacturing of high-quality PCBAs suitable for DOD operational environments.

Selected offerors will have opportunities to submit quotes throughout the BPA ordering period based on individual Statements of Work and technical data packages which may include notes, designs, bill of materials, and potentially Government Furnished Material (GFM).

The maximum ordering ceiling for each BPA holder is $7.5 million divided by the number of qualified offerors.

Period of Performance
The period of performance for the BPAs is set from 2026 to 2030.

Place of Performance
The geographic location for performance and delivery is primarily at the Defense Microelectronics Activity located at 4234 54th Street, McClellan, California 95652.

Overview

Agency

Defense Microelectronics Activity (DMEA) [DoD]

Response Deadline

Aug. 18, 2025, 5:00 p.m. EDT (original: Aug. 15, 2025, 5:00 p.m. EDT) Past Due

Posted

July 24, 2025, 4:55 p.m. EDT (updated: Aug. 15, 2025, 2:14 p.m. EDT)

Set Aside

Small Business (SBA)

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

PSC

5998 - Electrical And Electronic Assemblies, Boards, Cards, And Associated Hardware

Place of Performance

United States

Source

Open

Current SBA Size Standard

750 Employees

Pricing

Likely Fixed Price

Est. Level of Competition

Low

Est. Value Range

$7,500,000 (value based on agency estimated range)

Vehicle Type

Blanket Purchase Agreement

On 7/24/25 Defense Microelectronics Activity issued Synopsis Solicitation HQ072725QRT04 for Multiple Award PCB Fab and Assembly BPAs 2026-2030 due 8/18/25. The opportunity was issued with a Small Business (SBA) set aside with NAICS 334418 (SBA Size Standard 750 Employees) and PSC 5998.

Primary Contact

Name

RYAN C TUNG Profile

ryan.c.tung.civ@mail.mil

Phone

None

Additional Contacts in Documents

Title	Name	Email	Phone
None	None Profile	steven.b.nelson25.civ@mail.mil	None

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Additional Details

Source Agency Hierarchy

DEPT OF DEFENSE > DEFENSE MICROELECTRONICS ACTIVITY (DMEA) > DEFENSE MICROELECTRONICS ACTIVITY

FPDS Organization Code

9771-HQ0727

Source Organization Code

100139030

Last Updated

Sept. 3, 2025

Last Updated By

ryan.c.tung.civ@mail.mil

Archive Date

Sept. 2, 2025

Multiple Award PCB Fab and Assembly BPAs 2026-2030

Opportunity Assistant