Multichip Module Package for SiC Pressure Sensors

Background
This is a sole source requirement for the Multichip Module Package for Silicon Carbide (SiC) Pressure Sensors. The contract is issued by NASA, specifically for the Transformational Aeronautics Concepts Program and the Transformational Tools and Technologies Project. The goal of this contract is to procure specialized packaging for SiC integrated pressure/temperature sensors, which are critical for various aerospace applications.

Work Details
The vendor will be responsible for the following deliverables:
- Attachment of Silicon Carbide (SiC) integrated pressure/temperature sensors to an aluminum nitride (AlN) circuit board in a Multi-Chip Module (MCM) configuration.
- The circuit board must be made of AlN with a coefficient of thermal expansion not exceeding 4 ppm/C, closely matching that of SiC.
- Au-plated Nickel pins are to be inserted into blind holes on the circuit board and securely attached using gold (Au).
- The AlN receptacle must be hermetically brazed to a Kovar tube and capable of withstanding temperatures up to 700°C.
- The completed AlN circuit board with sensors and pins, as well as the hermetically brazed AlN receptacle, must be delivered to the customer.

Period of Performance
Delivery is required on or before December 31, 2026.

Place of Performance
NASA Glenn Research Center, 21000 Brook Park Road, Mail Stop 77-2, Cleveland, OH 44149.

Bidder Requirements
The vendor must comply with export control regulations as this document contains technical data restricted by the Arms Export Control Act and the Export Control Reform Act of 2018. Additionally, bidders should be aware that distribution is authorized only to U.S. Government agencies and their contractors.