Miniature Integrated Thermal Management Systems for 3D Heterogeneous Integration (Minitherms3D)

Background
The Minitherms3D program seeks to revolutionize thermal management for three-dimensional heterogeneous integration (3DHI). This program seeks to significantly reduce thermal resistances within the 3D stack and external to the stack of 3DHI systems, while increasing volumetric heat removal.

Work Details
The Statement of Work (SOW) includes technical reports to be submitted on a quarterly basis, two working days prior to each technical review meeting. Other proposed deliverables specific to the objectives of the individual efforts may include registered reports, experimental protocols, publications, data management plan, intermediate and final versions of software libraries, code, and APIs, documentation and user manuals, and/or a comprehensive assemblage of design documents, models, modeling data and results, and model validation data. Additionally, monthly financial reports describing resources expended, resources available, any deviation from planned expenditures, and any potential issues requiring attention are required within 10 days from the end of each month. The end of phase report shall summarize the effort in a comprehensive text document. No Government Furnished Equipment, Property, or Information will be provided in this program. Any proposed use of intellectual property should be clearly identified in the proposal. Multiple awards are anticipated with the amount of resources made available depending on the quality of the proposals received and the availability of funds.