HPCMP Technical Insertion BOA On Ramp Opportunity   6

Background
The U.S. Army Engineering Research and Development Center (ERDC) is issuing this combined synopsis/solicitation to interested firms with the capability to on-ramp onto an existing suite of BOAs for supercomputer Technology Insertions (TIs) in support of the High Performance Computing Modernization Program (HPCMP). The existing HPCMP BOAs current capacity is $369.75M. The existing BOA suite was established in October 2021 with a five (5) year life cycle, ceasing in October 2026. This notice is an invitation to any size business concern to provide a capability statement in response to this requirement. This announcement seeks to evaluate industry's ability to provide sustainable, state-of-the-art, HPC capability for the DoD research, development, test, and evaluation (RDT&E) community. This requirement is in direct support of the DoD HPCMP's mission - to accelerate the development and transition of advanced defense technologies into superior warfighting capabilities by exploiting and strengthening U.S. leadership in supercomputing, communications, and computational modeling. The HPCMP continues to enhance its ability to support DoD and the warfighter through the acquisition of balanced HPC systems for five DOD Supercomputing Resource Center (DSRCs). The Government is interested in uncovering industry's ability to deliver balanced, commercially-available, production-grade HPC systems, which contain an appropriate combination of processor, memory, disk I/O, interconnect, and operating system (OS) capabilities in order to conduct complex, tightly-coupled, large-scale, scientific calculations.

Work Details
The offeror shall provide a Technical Narrative that provides supporting projects, experience, and information to demonstrate acceptability for FACTOR 1: TECHNICAL CAPABILITY.
Element 1 – American OEM Status: The offeror shall demonstrate its status as an American OEM by providing sufficient examples of large, balanced, commercially-available, production-grade HPC systems that the offeror successfully manufactured in the United States and installed, administered, and maintained within the past three years.
Element 2 – Manufacturing and Installations: The offeror shall demonstrate its technical ability to manufacture and install HPC systems which contain an appropriate combination of processor, memory, disk I/O, interconnect, and operating system (OS) capabilities in order to conduct complex, tightly-coupled, large-scale scientific calculations in support of approximately 300 active users.

Period of Performance
The existing BOA suite was established in October 2021 with a five (5) year life cycle ceasing in October 2026.

Place of Performance
The geographic location(s) where the product will be delivered or performed at.