High Operational Temperature Sensors (HOTS)

Background
The High Operational Temperature Sensors (HOTS) program aims to develop high-bandwidth, high-dynamic-range analog sensor microelectronics technologies that operate at high temperatures. The program will leverage recent advances in wide-bandgap transistors, demonstrations of thermally robust transducer materials, and insight from HI techniques to overcome technical challenges and form highly-integrated, thermally hardened sensors.

Work Details
The program will consist of a 36-month schedule with a single technical area executed across two phases: an 18-month Phase 1 (base) and an 18-month Phase 2 (option). The potential program expansion into a third phase is possible depending on success in the first two phases. The work will involve demonstrating individual devices and integration methods addressing the technical challenges at 800 °C in Phase 1, designing full circuits and simulating performance of the integrated sensor system based on measured component results.
Phase 2 will demonstrate full sensor module integration meeting the performance goals at 800 °C. A potential Phase 3 will package and harden the sensor with a flush sensing element to withstand dynamic environmental conditions.

Period of Performance
The program is scheduled to start in January 2024 and will have two phases with an 18-month Phase 1 (base) and an 18-month Phase 2 (option). A program expansion into a third phase is possible based on success in the first two phases.