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GVSC E-Vetronics High-Performance Computing Module RFI

ID: W912CH_E-Vetronics_HPCM_RFI • Type: Sources Sought

Description

Description of Intent:

The U.S. Army Contracting Command - Detroit Arsenal (ACC-DTA), in conjunction with U.S. Army's Combat Capabilities Development Command Ground Vehicle Systems Center (DEVCOM GVSC) Vehicle Electronics and Architecture (VEA), is issuing a Request for Information (RFI) for the procurement of a High-Performance Computing Module (HPCM) solution for U.S. Army Ground Combat Vehicles. A HPCM is a computing device that balances edge computing and centralized computing. GVSC - VEA is requesting information on all potential High-Performance Computing processor chip solutions that address HPCMs. However VEA is not soliciting enterprise HPCM solutions at this time.

Current U.S. Army Ground Combat vehicles intend to make use of emerging technologies to balance edge and centralized computing. These needs are based upon new features and capabilities to support fused sensor data with enough processing capacity to support additional capabilities including, but not limited to, Aided Target Detection/Recognition (AiTDR), Automated Lethality, Survivability, and Defense. The goal is to take current algorithms for these technologies as well as Artificial Intelligence/Machine Learning (AI/ML) capabilities and evaluate them for true processing needs.

The objective of this RFI is to better understand the availability and capabilities of products and the potential of manufacturers in both processor and processing technologies as well as gaining an understanding of total package integration challenges. The goal is to find that equilibrium balance of edge and centralized computing. The information gathered by the U.S. Army through this RFI, along with other market investigation data, is solely intended for use by the U.S. Army and will not be shared with any company. Participation in this RFI provides an important opportunity to influence the U.S. Army's approach to procuring the HPCM solution for U.S. Army Ground Combat Vehicles. The U.S. Government is in no way liable to pay for or reimburse any companies or entities that respond to this announcement. Any costs incurred by interested companies in response to this announcement will NOT be reimbursed. This is a RFI ONLY and is not a solicitation for proposals; therefore, no questions will be taken at this time. A prototype project will not be awarded in response to this announcement.

Background
The U.S. Army Contracting Command - Detroit Arsenal (ACC-DTA), in collaboration with the U.S. Army’s Combat Capabilities Development Command Ground Vehicle Systems Center (DEVCOM GVSC) Vehicle Electronics and Architecture (VEA), is issuing a Request for Information (RFI) for a High-Performance Computing Module (HPCM) solution intended for U.S. Army Ground Combat Vehicles.

The initiative aims to leverage emerging technologies to enhance computing capabilities, balancing edge and centralized computing to support advanced features such as Aided Target Detection/Recognition (AiTDR), Automated Lethality, Survivability, and Defense. This RFI seeks to gather insights on available products and manufacturer capabilities in processor and processing technologies, as well as integration challenges.

Work Details
The RFI specifically requests information on potential High-Performance Computing processor chip solutions that can address the requirements of HPCMs. The HPCM is defined as a computing device that effectively balances edge computing with centralized computing. The U.S. Army is not currently soliciting enterprise HPCM solutions but is focused on understanding the processing needs for current algorithms related to AI/ML capabilities.

Key areas of interest include:
- Processor and GPU product lines supported (e.g., Intel, AMD, Arm, Nvidia, Qualcomm).
- Performance in extreme heat within military ruggedized containers.
- Hardware safety features of processors.
- Supported video interfaces and independent display capabilities.
- Previous military applications of these interfaces.
- Support for Time Sensitive Networking (TSN).
- Input/Output (I/O) interface support.
- Processing power consumption performance metrics.
- Low-end operating temperatures of devices.
- Cost points for each device.
- Current Technology Readiness Level (TRL) of hardware security module technology.

Place of Performance
Responses will be submitted to Allison Kasper at the U.S. Government.

Overview

Response Deadline
Sept. 11, 2024, 3:00 p.m. EDT Past Due
Posted
Aug. 12, 2024, 11:47 a.m. EDT
Set Aside
None
Place of Performance
MI 48092 United States
Source
SAM

Est. Level of Competition
Average
Odds of Award
27%
On 8/12/24 ACC Detroit issued Sources Sought W912CH_E-Vetronics_HPCM_RFI for GVSC E-Vetronics High-Performance Computing Module RFI due 9/11/24. The opportunity was issued full & open with NAICS 334 and PSC 7B20.
Primary Contact
Name
David Asmar   Profile
Phone
None

Secondary Contact

Name
Allison Kasper   Profile
Phone
None

Documents

Posted documents for Sources Sought W912CH_E-Vetronics_HPCM_RFI

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Additional Details

Source Agency Hierarchy
DEPT OF DEFENSE > DEPT OF THE ARMY > AMC > ACC > ACC-CTRS > ACC WRN
FPDS Organization Code
2100-W56HZV
Source Organization Code
500045742
Last Updated
Sept. 27, 2024
Last Updated By
david.j.diroma.civ@army.mil
Archive Date
Sept. 26, 2024