ELectronics for G-band ARrays (ELGAR)

Background
The ELGAR program aims to develop integration technologies for compact, high-performance RF electronics, including monolithic microwave/millimeter wave integrated circuits (MMICs) and transmit and receive array front-end test articles, to enable communication and sensing systems at G-band frequencies.

Work Details
The work involves developing G-band III-V MMICs and Si RFICs from 180 GHz to 240 GHz, achieving efficient, compact G-band MMICs with high output power density, and achieving low-loss off-chip interconnects between adjacent G-band array components. The program is structured as a 48-month, three-phase program focused on developing integration technologies to compact and reduce loss of on-chip and off-chip RF interconnects. The technical area focuses on addressing two major technical challenges: achieving efficient, compact G-band MMICs with high output power density and achieving low-loss off-chip interconnects between adjacent G-band array components.

Period of Performance
Phase 1 (Base) will be 18 months, whereas Phases 2 (Option 1) and 3 (Option 2) will be 15 months each.