Custom printed circuit board for use throughout AFRC Simulation Branch

Background
The National Aeronautics and Space Administration (NASA) is issuing this Request for Quotation (RFQ) for the procurement of custom printed circuit boards (PCBs) to be utilized throughout the AFRC Simulation Branch.

The goal of this contract is to manufacture PCBs that will support hardware upgrades for the next generation of simulation computers, ensuring compliance with industry standards.

Work Details
The contractor shall manufacture printed circuit boards (PCBs) with the following specifications:
- Dimensions: 9.1 x 5.5 inches
- Layers: 8
- Finished copper weight: 1 ounce
- Fabrication must adhere to IPC-6012, Class 3 standards, and utilize supplied data files.
- Materials must comply with IPC-2221 par 4.3; laminated sheets must be flame resistant and meet UL 94V-0 standards.
- All holes are to be located on a modular grid of 0.0005-inch increments, within a radius of 0.005 inches from true position concerning datum A, B, and C.
- Layer-to-layer registration tolerance is within 0.007 inches diameter of true position.
- Soldermask for prototypes (first 5 units) shall be white with black silkscreen; production units (quantity 50) will have a blue solder mask and yellow silkscreen per specified colors and standards.
- Process allowances include maximum warp or twist of PCBs not exceeding 1%, conductor widths and spacing within +/-0.0015 inches of supplied Gerber data, and burr removal with sharp edges not exceeding 0.015 inches.

Period of Performance
The period of performance for this contract extends until July 21, 2025.

Place of Performance
The products will be delivered to NASA Shared Services Center located at Stennis Space Center, MS 39529-6000.