CHIPS R&D Data Acquisition System   2

Background
The National Institute of Standards and Technology (NIST) Infrastructure and Materials Group within the Engineering Laboratory is seeking a Data Acquisition System to collect in-situ resistance-based measurements throughout the structure of advanced test vehicles during accelerated aging experiments.

This work supports the CHIPS Metrology program, which develops cutting-edge metrology capabilities for the US semiconductor manufacturing ecosystem. The goal is to address critical metrology gaps and spur innovation within seven grand challenge areas related to semiconductor packaging reliability.

Work Details
The contract includes the following line items:
- CLIN 0001: Data Acquisition System, Quantity: 1 Each.
- Technical Specifications:
- Primarily used to measure resistance and resistance-based temperature changes throughout an interposer structure (e.g., underfill, redistribution layer, thermal interface layers) during accelerated aging.
- 300-400 wires will be measured for each sample.
- Low current/voltage measurements required, with expected resistance measurement not exceeding 5V.
- Minimum of 125 4-wire channels (to accommodate a minimum of 500 wires).
- Channels must be compatible with both 2-wire and 4-wire resistance-based measurements.
- Maximum voltage +/- 300 V; lower max voltages will be considered.
- Minimum scan rate of 100 channels/second; maximum current of 1 A; resistance range from 100 Ohms to 1 GOhm.
- Target basic resistance accuracy of 0.004% and basic DC voltage accuracy of 0.003%.
- Must accommodate screw connections for input wires, include data logging software, and have data analysis/export capability compatible with Windows 10/11.
- CLIN 0002: Shipping, Installation, and Training, Quantity: 1 Lot.
- CLIN 0003: Other transportation related charges (Not-to-Exceed amount), Quantity: 1 Lot.

Period of Performance
No later than 20 weeks after receipt of order.

Place of Performance
NIST (Gaithersburg)