2-D and 3-D Surface Mapping Across Multiple Microscopy Platforms

b. 2-D and 3-D Surface Mapping Across Multiple Microscopy Platforms Research is needed in machine vision approaches that correlate features in the spatial fields-of-view between optical microscopy platforms and analytical images obtained by other means such as SEM, SEM-Energy Dispersive Spectrometry (EDS), and SIMS. Software algorithms and/or instrumentation developed in this subtopic is of value to enable (i) scans of surfaces using various microscopies (e.g., electron or optical), (ii) image correlation to align and overlay images from combinations of imaging platforms, (iii) accurate indexing of features of interest on microscopy platforms to resolutions of 1 micrometer or better, and/or (iv) 3-D mapping of surface topography to assess surface uniformity as a function of position. Sample substrates typically require conductive materials such as metal-coated glass, silicon, or carbon and require registration at or better than the one-micrometer scale. Techniques are desired to assess surface uniformity, curvature, or address morphology as a function of position, for optically rough surfaces of the order of one square centimeter. Questions Contact: Timothy Ashenfelter, Timothy.Ashenfelter@nnsa.doe.gov