Trusted & Assured Microelectronics

The Trusted and Assured Microelectronics program, managed by the Office of the Secretary of Defense and led by the Under Secretary of Defense for Research and Engineering, is a Department of Defense (DoD) initiative focused on microelectronics modernization. Its primary goals are to ensure enduring access to state-of-the-art and advanced microelectronics, reduce reliance on obsolete and sole-source components, and mitigate supply chain risks. The program supports objectives of building a resilient Joint Force, defending the homeland, and deterring aggression by modernizing key defense capabilities and fostering rapid adoption of commercial and dual-use microelectronics technologies for military needs.

Access to State-of-the-Art Microelectronics - Demonstration is the largest line item within this program. Its objective is to establish strategic partnerships with domestic commercial foundries and design vendors to secure access to advanced manufacturing processes and develop a data-driven, evidence-based approach to supply chain protection. This project demonstrates the assured manufacture of advanced electronic components, enables secure DoD design capabilities, and transitions state-of-the-art technologies into DoD programs. Key efforts include initiatives that provide access to leading-edge fabrication, accelerate the adoption of evidence-based assurance methods, and facilitate the use of commercial off-the-shelf parts in critical defense applications.

The project also focuses on leveraging commercial expertise to develop novel design assurance capabilities, expanding access to third-party intellectual property and electronic design automation tools, and supporting the development of application-specific integrated circuits and chiplet security features. Planned activities for upcoming fiscal years include maintaining access to multiple domestic foundries, enhancing secure design environments, and accelerating the transition of prototypes to production readiness. The project also aims to raise the technology readiness level of emulation-based assurance design flows and expand the use of trusted commercial off-the-shelf parts for DoD applications.

Access to Advanced Packaging and Testing - Demonstration addresses the need for modern microelectronics packaging solutions that provide performance improvements, size, weight, power, and cost benefits, and enable the use of chiplets and heterogeneous integration. This project collaborates with DoD program offices, the Defense Industrial Base, and domestic industry to demonstrate self-sustaining advanced packaging and test solutions. Efforts focus on transitioning multi-chip packaging prototypes into DoD systems and upskilling the government workforce through access to prototype development kits.

The Advanced Packaging and Testing project aims to accelerate the development and demonstration of secure, reliable, and high-performance packaging solutions for DoD applications, including radio frequency and autonomy systems. Planned activities include expanding prototype demonstrations, enhancing security and supply chain visibility, and developing tools and techniques for secure packaging. The project also supports risk reduction through improved material tracking and process control, and works to ensure that advanced packaging capabilities are available domestically to meet future DoD requirements.

DOD Unique NDS RADHARD - Demonstration focuses on meeting the DoD's unique requirements for radiation-hardened, radio frequency, and opto-electronic microelectronics. This project sustains specialty suppliers and partners with the intelligence community, Department of Energy, and NASA to develop and demonstrate radiation-hardened components for space and harsh environments. It supports both state-of-the-practice and state-of-the-art technologies through activities that include Radiation Hardened By Process and Radiation Hardened By Design, and invests in maturing radio frequency Gallium Nitride, integrated photonics, and Power Silicon Carbide technologies for next-generation sensors and communications.

The RADHARD project's objectives include increasing capacity for radiation-hardened by design technologies, maturing open-access radio frequency Gallium Nitride foundries, advancing co-packaged optics and high-bandwidth data transfer capabilities, and supporting workforce development in radio frequency, power, and photonics. Planned demonstrations will enable compact millimeter wave transceivers, edge compute for artificial intelligence, and other critical defense applications. The project also addresses gaps not met by commercial trends, ensuring the DoD maintains access to essential microelectronics expertise, technology, and manufacturing for national security.