The Microelectronics Commons - 0400D program, managed by the Office of the Secretary of Defense under Program Element PE 0602669D8Z, is a key Department of Defense (DoD) initiative aimed at strengthening the domestic microelectronics innovation ecosystem. The program's primary goal is to support the DoD's broader strategic objectives to build sustainable and long-term technological advantage, defend the homeland, and deter aggression. This effort is executed by the Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E)), in accordance with the Fiscal Year 2021 National Defense Authorization Act (NDAA) and the CHIPS for America Act. It is funded through the CHIPS for America Defense Fund established by the CHIPS Act of 2022.
The program's main objective is to establish and operate the Microelectronics Commons, a national network of regional innovation hubs designed to facilitate the transition of microelectronics research from laboratory environments to fabrication facilities ( lab-to-fab ). This network aims to promote domestic on-shoring of critical microelectronics capabilities, addressing economic and technology security concerns highlighted in recent legislation. By leveraging public-private partnerships, the Commons seeks to connect university labs, small business R&D teams, and existing semiconductor companies. This approach fosters a robust pipeline of innovative ideas and technical talent across the United States.
A significant focus of the program is on applied research activities, including staffing at Commons hub facilities, early identification of promising microelectronics technologies, prototyping planning, and the development of experimental tools. The program supports the maturation of new materials, processes, devices, and architectural designs, with the intent to create new manufacturing paradigms based on agile fabrication processes. These efforts are critical for maintaining U.S. leadership in microelectronics and ensuring that emerging hardware technologies can be efficiently adopted and manufactured domestically.
The principal line item under this program element focuses on the early research and development of microelectronics technologies with potential DoD applications. It also supports the establishment and operation of Commons Hubs, which are regional centers organized in collaboration with a Consortium Manager to address both defense and commercial needs. Each Hub specializes in one of six technical areas: Secure Edge Computing, 5G/6G Technology, Artificial Intelligence Hardware, Quantum Technology, Electromagnetic Warfare, and Commercial Leap Ahead Technologies.
Core fabrication facilities ( fabs ) are integral to the Hubs network, providing essential prototyping capabilities to demonstrate the manufacturing and economic benefits of new technologies. The program also invests in Electronic Design Automation (EDA) tools. As of the fourth quarter of FY 2024, the program has awarded eight Innovation Hubs, with hub membership exceeding 1,300 individuals from 45 states. A total of 34 hub projects have been funded, alongside 24 services projects.
In addition to research and prototyping, the program integrates workforce development initiatives to build and sustain a domestic semiconductor workforce. Activities span K-12, undergraduate, graduate, and continuing education, including internships and post-doctoral training at Hub facilities. Beginning in FY 2026, workforce development funding is consolidated within the research maturation project to ensure these efforts are closely tracked and integrated with ongoing research activities.