Advanced Electronics Technologies

The Advanced Electronics Technologies Program, managed by the Defense Advanced Research Projects Agency (DARPA) under Program Element (PE) 0603739E, is focused on advancing research, development, and demonstration of next-generation electronics and microelectronic devices for military applications. The program's overarching goal is to develop state-of-the-art manufacturing and processing technologies, including sensor systems and integrated photonic-electronic components, that can meet evolving Department of Defense (DoD) requirements while also enabling commercial sector adoption. By introducing advanced product design capabilities and flexible, scalable manufacturing techniques, the program aims to facilitate rapid, cost-effective fulfillment of military needs and transition novel technologies into operational use.

MT-15: Mixed Technology Integration is a key project within this program, supporting the advanced development and demonstration of selected basic and applied electronics research initiatives. Its objectives include reducing the size, weight, and power (SWaP) of components for laser weapon systems to enhance airborne platform protection against emerging surface-to-air missile threats. The project also funds integrated photonic-electronic components for positioning, navigation, and timing in GPS-denied environments. Other efforts include development of flexible, software-defined cameras for real-time image analysis and optical communications systems optimized for SWaP-restricted platforms. The emphasis is on transitioning these technologies to provide advanced components compatible with mid-term and future warfighting requirements.

Within MT-15, the Modular Efficient Laser Technology (MELT) program is developing compact, high-power laser tiles as building blocks for scalable high energy laser (HEL) sources. MELT leverages advances in coherent beam combining, photonic integrated circuits, and semiconductor manufacturing to create tiled arrays integrated with low-loss waveguides and application-specific integrated circuits. The goal is to enable scalable HEL architectures suitable for deployment on SWaP-constrained platforms, with intended transition to the Army, Air Force, and Navy. The project includes fabrication of full laser tile arrays, design reviews, and integration of advanced semiconductor cooling and optical lithography techniques.

Another MT-15 initiative, Box Kick, is focused on developing a cost-effective capability to engage and defeat raids of adversary subsonic cruise missiles and unmanned aerial systems. The program aims to integrate this capability into existing platforms with minimal modifications, preserving more advanced and expensive weapons for higher-end threats. Planned activities include kinematic testing, hardware development, controlled environment test series, and platform integration planning, with transition to the Services upon completion.

The Wideband Secured and Protected Emitter and Receiver (WiSPER) program under MT-15 sought to develop an ultra-broadband technology platform for robust, secure, and protected communications. WiSPER addressed assured communications, throughput, security, and SWaP limitations for future command, control, communications, computers, intelligence, surveillance, and reconnaissance (C4ISR) missions. The program developed compact antennas, radio frequency front-end electronics, mixed-signal circuits, and waveform technologies, culminating in a demonstration of a secured communication link for potential transition to the Services.

MT-16: Beyond Scaling Advanced Technologies supports the transition of disruptive microelectronics advancements, including those from the Beyond Scaling Sciences and Technology projects. Its objectives include developing new technologies in commercial settings, establishing access to state-of-the-art foundries, enabling prototyping, and advancing manufacturable processes for three-dimensional heterogeneous integration (3DHI), integrated photonics, and new architectures for advanced field programmable gate arrays (FPGAs). The project also focuses on innovating back end of line technologies for wide bandgap semiconductors and facilitating the transition of these capabilities to DoD and commercial users.

Within MT-16, the Next Generation Microelectronics Manufacturing (NGMM) program is establishing a domestic capability for research, development, and production of 3DHI microelectronics. The program aims to create an open-access prototyping and pilot line center, providing equipment, design kits, electronic design automation workflows, and test standards to accelerate innovation. Additional MT-16 initiatives include the Continuous-correctness On Opaque Processors (COOP) program, which validates continuous software correctness on advanced processors, and the Supply Chain & Logistics in Electronic Technology program, which develops technologies to ensure a robust and secure domestic supply chain for advanced microsystems. These efforts are designed to sustain U.S. leadership in microelectronics, enhance reliability and security, and enable rapid transition of disruptive technologies to defense and commercial sectors.