Advanced Electronics Technologies

The Advanced Electronics Technologies Program, managed by the Defense Advanced Research Projects Agency (DARPA), focuses on developing cutting-edge manufacturing and processing technologies for electronics and microelectronic devices with military applications. The program aims to enhance design capabilities and manufacturing techniques that can be rapidly adapted by the commercial sector to meet military needs efficiently. This initiative includes projects like Mixed Technology Integration, which supports the development of advanced electronics research programs. These efforts aim to reduce the size, weight, and power of components for systems like laser weapons and optical communications, ensuring compatibility with future military requirements.

The Mixed Technology Integration project specifically targets advancements in electronics research that can be transitioned into practical military applications. It supports technologies such as integrated photonic-electronic components for navigation in GPS-denied environments and software-defined cameras for real-time image analysis. The project also focuses on developing optical communication systems suitable for platforms with strict size, weight, and power constraints. By advancing these technologies, the project seeks to provide innovative solutions that align with mid-term warfighting needs.

Beyond Scaling Advanced Technologies is another critical component of this program, aiming to accelerate disruptive advancements in microelectronics. This project supports the development of new technologies in commercial settings, facilitating access to state-of-the-art foundries and enabling prototyping. It emphasizes three-dimensional heterogeneous integration processes and advances in field programmable gate arrays (FPGAs). By fostering these innovations, the project seeks to maintain U.S. leadership in semiconductor technology and support defense applications through enhanced microelectronics capabilities.

The Next Generation Microelectronics Manufacturing initiative under this program is designed to establish a domestic capability for three-dimensional heterogeneous integration (3DHI). This effort focuses on creating a robust ecosystem for microsystems design, fabrication, packaging, assembly, and testing. By providing a baseline fabrication capability for research test articles, this initiative aims to accelerate domestic development in microelectronics and support a wide range of stakeholders in advancing next-generation technologies. Through these efforts, DARPA seeks to ensure that the U.S. remains at the forefront of microelectronics innovation while addressing critical defense needs.