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UEI: T4Y8NWLNK9J5 • CAGE: 086K9

Overview

Awardee Type
Parent
Federal Capability Statement
MBE and CBE growth of Compound Semiconductor epitaxial wafers, Device processing on 100mm, 150, and 200mm wafers, rental of scientific equipment, laboratory design and setup at low cost
Keywords
Compound Semiconductor, GaN, GaAs, InP, LED, Laser, VCSEL, IR, FLIR, MBE, MOCVD, CBE, 100mm, 150mm, 200mm, Wafer Bonding
SBA Special Equipment
MBE, CBE, Compound Semiconductors
Headquarters
Red Wing, MN
United States
Federal contract and grant recipient OSEMI INC (UEI T4Y8NWLNK9J5, CAGE 086K9) is headquartered in Red Wing MN. Its primary registered NAICS is 334413 Semiconductor and Related Device Manufacturing. The corporation was founded in November 1994 and federally registered in July 2001.

Federal Award Analysis

Osemi federal award history

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Federal Registration and Certifications

Legal Name
OSEMI INC
UEI
T4Y8NWLNK9J5
CAGE Code
086K9
SBA Certifications
None
Self Certifications
For Profit Organization, Manufacturer of Goods, Subchapter S Corporation
Entity Structure
Corporate Entity (Not Tax Exempt)

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