Grinding & Dicing Services
UEI: JB1LXJ2E3HV9
• CAGE: 3FEJ2
Overview
Parent Awardee
Federal Capability Statement
GDSI provides wafer grinding and dicing to large and small integrated circuit manufacturers as well as fabless companies. GDSIs service offerings include backgrinding, dicing and saw, pick and place, automated inspection, and wafer polishing.
Keywords
Grinding, dicing, semiconductortapes
Website
Headquarters
San Jose, CA
United States
United States
Most Recent Award
May 31, 2012
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Federal contract recipient
GRINDING & DICING SERVICES, INC.
dba GRINDING & DICING SERVICE
(UEI JB1LXJ2E3HV9, CAGE 3FEJ2)
is headquartered in San Jose CA.
Its primary registered NAICS is 334413 Semiconductor and Related Device Manufacturing.
The corporation
was founded in August 1992 and
federally registered in
May 2003.
Federal Award Analysis
Grinding & Dicing Services federal award history
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Contracts
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Subcontracts
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Grants
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Subgrants
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Total
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Federal Registration and Certifications
Legal Name
GRINDING & DICING SERVICES, INC.
DBA
GRINDING & DICING SERVICE
UEI
JB1LXJ2E3HV9
CAGE Code
3FEJ2
Primary NAICS
SBA Certifications
None
Self Certifications
None
Entity Structure
Corporate Entity (Not Tax Exempt)
Purpose of Registration
Federal Contracts and Assistance
Date Founded
Aug. 1, 1992
Initial Registration
May 12, 2003
Last Registration
Aug. 28, 2024
Registration Activation
Aug. 14, 2024
Registration Expiration
Aug. 12, 2025
Fiscal Year End
June 30
Reported Entity Types
For Profit Organization
State of Incorporation
CA
Country of Incorporation
USA
Employees
<500
Reported NAICS
Accepts Credit Cards
Yes