Finetech
UEI: HTJBD8W4KWY7
Overview
Awardee Type
Parent
(1 child)
Company Description
FINEPLACER® pico 2 The Most Powerful Tool for Lab & Research Finetech is the leading equipment manufacturer for sub-micron die bonding & advanced SMD rework.We provide solutions for each stage of your journey – from R&D to industrial automated production. Research & Development Our R&D Bonders are ready to tackle the challenges of today and tomorrow. Flexible, accurate and retrofittable […]
Name
Finetech
Headquarters
Mesa, AZ
United States
United States
Most Recent Award
Jan. 29, 2025
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Federal contract recipient
FINETECH
(UEI HTJBD8W4KWY7)
is headquartered in Mesa AZ.
Its primary registered NAICS is 333242 Semiconductor Machinery Manufacturing.
The corporation
was founded in October 1994 and
federally registered in
May 2002.
Federal Award Analysis
Finetech federal award history
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Contracts
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Subcontracts
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Grants
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Subgrants
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Federal Registration and Certifications
This Parent entity does not have an associated active registration. Showing registration information for UEI DL8LPYERW429 CAGE 1YMD5 instead.
Legal Name
FINETECH
UEI
DL8LPYERW429
CAGE Code
1YMD5
Primary NAICS
SBA Certifications
None
Self Certifications
None
Entity Structure
Corporate Entity (Not Tax Exempt)
Purpose of Registration
Federal Contracts and Assistance
Date Founded
Oct. 3, 1994
Initial Registration
May 24, 2002
Last Registration
Sept. 4, 2024
Registration Activation
Sept. 4, 2024
Registration Expiration
Sept. 3, 2025
Fiscal Year End
June 30
Reported Entity Types
For Profit Organization
State of Incorporation
CA
Country of Incorporation
USA
Employees
<500
Reported NAICS
Accepts Credit Cards
Yes
People
Vendor contacts at Finetech
Contract Awards
Finetech prime contract awards
Subcontract Awards
Finetech subcontract awards
State and Local Awards
Finetech state and local contract awards
Click here to learn more about State and Local award data coverageTeaming Partners
Disclosed awardee sub and prime contract and grant relationships
Finetech