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BGA Technology LogoBGA Technology

UEI: K7GFWD54VDP7 • CAGE: 6EMC9

Overview

Awardee Type
Parent
Federal Capability Statement
Re-balling BGA Style Components. RoHs Conversion Lead tinning Electrical testing Of Semiconductors Testing Electronic Components Screening For Counterfeit as per AS5553 or AS6081
Keywords
BGA Re-Balling, Re-Balling, Re-Tinning, Testing Components, Semiconductors
Quality Assurance Certifications
ISO-9000 Series
Headquarters
Holbrook, NY
United States
Federal contract recipient BGA TECHNOLOGY LLC (UEI K7GFWD54VDP7, CAGE 6EMC9) is headquartered in Holbrook NY. Its primary registered NAICS is 334413 Semiconductor and Related Device Manufacturing. The corporation was founded in June 2010 and federally registered in June 2011.

Federal Award Analysis

BGA Technology federal award history

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Federal Registration and Certifications

Legal Name
BGA TECHNOLOGY LLC
UEI
K7GFWD54VDP7
CAGE Code
6EMC9
SBA Certifications
None
Self Certifications
For Profit Organization, Limited Liability Company
Entity Structure
Corporate Entity (Not Tax Exempt)

People

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Subcontract Awards

BGA Technology subcontract awards

Teaming Partners

Disclosed awardee sub and prime contract and grant relationships

BGA Technology