MARKET INTEL |
PRIME CONTRACT

Purchase Order - FA945321P0508

OVERVIEW

Awardee
Original Description
NEXT GENERATION DEVICE ATTACHMENT THERMAL INTERFACE MATERIAL
Place of Performance
San Jose, CA USA
Pricing
Fixed Price
Set Aside
Small Business Set Aside - Total (SBA)
Extent Competed
Full And Open Competition After Exclusion Of Sources
Related Opportunity
None

SBIR DETAILS

Research Type
Small Technology Transfer Research Program (STTR) Phase I
Title
Versatile NanoCopper-Based TIM exceeding 50% Bulk Metal Performance
Abstract
Kuprion and Lockheed Martin Corp. joined forces to propose the use of a novel nanocopper materials technology that allows the use of copper as a versatile and effective thermal interface material. Kuprion nanocopper converts to bulk copper at temperatures 195-240„ƒ in 5-8 min using standard solder reflow equipment under benign nitrogen environment, preventing oxidation during fusion. No pressure required. It has demonstrated drop-in replacement for solder. Thermal interface layers as thin as 2 micron have been achieved already via hand assembly of LED systems and have 20-25% improvement of Rth compared to AuSn solder. Bulk measurements revealed an intrinsic thermal conductivity of 277 W/m*K. Coupled with RMS expertise in die attachment techniques and companion electronics, this system provides an ideal solution for realizing high performance TIM for power electronics. The material is readily dispensable and stencil printable for die bonding and PCB assembly. The small amounts of additives and surfactants completely evaporate during fusion, eliminating any post cleaning requirements. It lacks a liquid transition state, which eliminates wicking during processing allowing for very close spacing of components/leads / contacts. The formulation will be modified to reduce CTE to increase stability to thermal cycling for maximize life under harsh operating conditions.
Topic Code
AF192-033
Solicitation Number
19.2
Contact
Andrew Hartland
(408) 206-0122
andrew.hartland@kuprioninc.com

STATUS
(Complete)

Period of Performance

4/15/21

Start Date

1/17/22

Current End Date

1/17/22

Potential End Date
100% Complete

Obligations

$150.0K

Total Obligated

$150.0K

Current Award

$150.0K

Potential Award
100% Funded

AWARD RELATIONSHIPS

Purchase Order

FA945321P0508

Subcontracts

-

Purchase Order

FA945321P0508

Subs

-

ACTIVITY TIMELINE

SUBCONTRACT AWARDS

Opportunity Lifecycle

HISTORY

COMPETITION
Solicitation Procedures
Negotiated Proposal/Quote
Number of Offers Received
8
Other Than Full and Open Competition
None
Evaluated Preference
None
Commercial Item Acquisition
Commercial Item Procedures Not Used
Simplified Procedures for Commercial Items
No

OTHER CATEGORIZATIONS

Subcontracting Plan
Plan Not Required
National Interest Action
None
IT Commercial Item Category
Not Applicable
AGENCY DETAIL
Created By
usercw@sa5700.fa9451
Last Modified By
usercw@sa5700.fa9451
Approved By
usercw@sa5700.fa9451
Awarding Office
FA9453 FA9453 AFRL RVK
Funding Office
F2KBAA AFRL RVF

LEGISLATIVE MANDATES

Clinger-Cohen Act Compliant
No
Construction Wage Rate Requirements
Not Applicable
Labor Standards
Not Applicable
Materials, Supplies, Articles & Equipment
Not Applicable
Last Modified: 7/12/21


PIID: FA9453-21-P-0508